ATS-10H-15-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

A Heat Sink is a type of heat-absorbing device, usually made of metal, that is designed to transfer and dissipate thermal energy. Heat sinks are used primarily to dissipate heat from an electrical component in order to prevent it from becoming damaged due to excessive temperature. The type commonly used in the industry today is the ATS-10H-15-C1-R0, which is designed for low-profile applications and offers good thermal performance.

Applications

Heat sinks are typically used to cool electronic components in computers and other electronic devices. The ATS-10H-15-C1-R0 is especially well suited to cooling low-profile applications due to its small size and high thermal performance. It is an ideal choice for notebook computers, where size and space are at a premium. In addition, the small size of the ATS-10H-15-C1-R0 makes it an ideal choice for consumer electronics devices, such as smartphones, tablets, and TVs, as well as for industrial control systems.

Advantages

The primary advantage of the ATS-10H-15-C1-R0 heat sink is its high thermal performance. It is able to dissipate more heat than some other types of heat sinks due to its highly efficient design. Additionally, it is smaller in size than other types, making it an attractive option for low-profile applications. It is also lightweight and easy to install, making it ideal for thermal management in even the most space-constrained applications.

Working Principle

The ATS-10H-15-C1-R0 heat sink works by transferring the heat generated by an electronic component away from the component and dissipating it into the surrounding environment. The heat is dissipated through conduction, convection, and radiation. The heat sink’s design helps to ensure an efficient transfer of heat, allowing it to dissipate the heat away from the component quickly and efficiently.

Materials

The ATS-10H-15-C1-R0 heat sink is made from aluminum, which is an excellent material for thermal management because of its excellent thermal properties and ability to absorb heat. It is also lightweight and corrosion-resistant, making it an ideal choice for thermal management applications.

Conclusion

The ATS-10H-15-C1-R0 heat sink is an ideal choice for low-profile applications due to its small size, high thermal performance, and easy installation. It is made from aluminum, which makes it lightweight and corrosion-resistant, ideal for thermal management. Additionally, its highly efficient design ensures an effective transfer and dissipation of thermal energy, making it an effective solution for thermal management in electronic devices.

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