| Allicdata Part #: | ATS18348-ND |
| Manufacturer Part#: |
ATS-10H-150-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-150-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technology consists of various components in order to expel the generated heat from an electronic device without the risk of it overheating. Heat sinks are one of those components. In devices that generate considerable amounts of heat, such as telecommunication systems, embedded-device microprocessor systems, or any accumulation of electronics, heat management is an essential consideration when setting the system up correctly. The ATS-10H-150-C2-R0 heat sink is an effective tool in alleviating the thermal load on an accumulation of circuits.
The ATS-10H-150-C2-R0 is a stamped-style heat sink. This type of heat sink uses an array of metal pins that are arranged to create an optimal surface area for efficiently dissipating generated heat. This style of heat sink is ideal for applications with low clearance constraints and high demand for adequate heat dispersal, as they maintain or improve efficient performance even when under high operating temperatures. With an overall height of 25.4 mm, a length of 91.44 mm, and a width of 50.8 mm, this particular model is built to efficiently manage high operating temperatures without taking up too much space.
The ATS-10H-150-C2-R0 is perfect for telecommunication systems, embedded-device microprocessor systems, and other electronics where thermal load management is a requirement. This heat sink is capable of efficiently dissipating temperatures of up to 150°C with its optimized shape. Its aggressive bent finger design helps distribute the heat uniformly as well as seamlessly. Additionally, because of its slim design and low profile, it can be conveniently installed in systems with minimal impedance from surrounding components.
The ATS-10H-150-C2-R0 heat sink also comes with multiple mounting features, such as standard press-fit pads and through-hole mounting options. This allows the heat sink to be effectively and precisely installed in any system, reducing the risk of the system overheating. It also has an anodized aluminum finish, which helps extend its durability and makes it compatible with most ambient temperatures.
Overall, the ATS-10H-150-C2-R0 heat sink is a reliable and efficient solution for any application where thermal management is of the utmost importance. With its high thermal load dissipation capabilities combined with its slim design, it is perfect for telecommunications, embedded devices, and any other applications where space is a constraint and heat management is a priority.
The specific data is subject to PDF, and the above content is for reference