| Allicdata Part #: | ATS-10H-150-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-150-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-150-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal Management has become increasingly important in modern electronic systems design as heat build-up continues to be a major challenge. One of the most important components in thermal management is the heat sink. A heat sink is a device that is attached to an electrical component to dissipate thermal energy away from it. It absorbs and dissipates the heat generated by the electronic components. Heat sinks can be used to improve device performance or simply prevent the device from overheating, resulting in device failures.
The ATS-10H-150-C3-R0 is a type of heat sink specifically designed for use in power electronics applications, particularly in high power applications requiring forced air. It utilizes an extruded aluminum material with fins for increasing heat dissipation. The device is designed to be mounted directly onto power electronics components such as motor controllers, power supplies, inverters, and batteries. It is also commonly used in renewable energy applications, such as solar or wind power applications.
The ATS-10H-150-C3-R0 has a two-layer construction, consisting of a base layer and a finned layer. The base layer is made of extruded aluminum and is the component that is attached directly to the device. The finned layer is made of either copper or aluminum and has a series of fins to increase the surface area. This increased surface area allows for the efficient transfer of heat away from the device.
The working principle of a heat sink is to transfer heat away from the device it is attached to and to dissipate it into the surrounding environment. Heat sinks use convection to achieve this. Heat sinks work by increasing the surface area of the material they are attached to, which increases the rate of heat transfer from the device. The increased surface area of the fins also allows for increased air flow, which further increases the rate of convection heat transfer.
The use of a heat sink is essential in virtually any device or system that generates heat, as this allows for improved performance and prevents device overheating caused by heat build-up. Heat sinks are an economical and efficient way to manage and dissipate heat generated by power electronics devices. The ATS-10H-150-C3-R0 is an ideal solution for high power electronics applications, as its two-layer design, high-quality materials, and increased surface area for optimal thermal dissipation.
The specific data is subject to PDF, and the above content is for reference