
Allicdata Part #: | ATS-10H-158-C3-R0-ND |
Manufacturer Part#: |
ATS-10H-158-C3-R0 |
Price: | $ 4.43 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 40X40X35MM L-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.99042 |
30 +: | $ 3.76887 |
50 +: | $ 3.54715 |
100 +: | $ 3.32545 |
250 +: | $ 3.10376 |
500 +: | $ 2.88206 |
1000 +: | $ 2.82664 |
Specifications
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 1.378" (35.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
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A thermal-heat sink, also known as a thermoelectric or thermal management device, is a device that absorbs and dissipates heat from electronic components to help keep them at safe temperatures. The ATS-10H-158-C3-R0 device is a high-end thermal-heat sink designed for commercial and industrial applications within the semiconductor industry. It is designed to help maintain stable power delivery and reduce component temperatures so that the system can operate reliably and avoid electrical failure.
The device has a copper base with an aluminum top. The aluminum top features an array of waffle-like channels, a combination of both vertical and horizontal channels. These channels are designed to provide increased surface area for heat dissipation. The copper base also carries a thin insulated coating that acts as an insulator to help it maintain its form and stability. Heat is transferred from the device to the channels, where it is quickly dissipated.
The ATS-10H-158-C3-R0 device is designed with an excellent thermal conductivity of 400 W/mK. This ensures that heat can be quickly and effectively removed from the device, increasing the device\'s efficiency in cooling the system. The high thermal conductivity also means that the device can cool the entire system quickly and effectively. The device also features an aluminum top that has a thermal resistance of 0.6 K/W.
The device\'s design allows it to be mounted with ease onto a variety of surfaces. The universal mounting system makes it easy to install the thermal-heat sink onto any surface without any additional parts. This makes it an effective and cost-efficient solution for controlling the temperatures of industrial and commercial systems. Furthermore, the device is also designed with an easy-to-use connection system that ensures it can be connected to a variety of components.
Stability and reliability are also key features of the device. The device is made with a polymeric material that ensures it will maintain its shape and form during extended periods of use. Furthermore, the device is designed to be resistant to corrosion and environmental factors, such as humidity, dust, and pollution. This helps the device remain in excellent condition for long periods of time.
The ATS-10H-158-C3-R0 device has proven to be an effective and reliable solution for the thermal management of commercial and industrial systems. The device is designed to be highly efficient in cooling components to maintain optimal temperatures while reducing ambient temperature. Its compact and lightweight design makes it an ideal choice for use in tight spaces, and its universal mounting system ensures it can be installed on virtually any surface. Furthermore, the device\'s durability and reliability make it a great choice for long-term use in industrial and commercial environments.
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