| Allicdata Part #: | ATS-10H-159-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-159-C3-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-159-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10H-159-C3-R0 can be classified as a thermal-heat sink device. It is designed to dissipate heat generated by electronic components, such as microchips, and maintain the ideal operating temperature for better performance. It is a great choice for cooling applications where space is limited.
Heat sinks are typically used to cool electronic components that generate heat, including CPUs, GPUs, transistors, and others. The ATS-10H-159-C3-R0 features a heat sink design that consists of a base and fins made of aluminum. The aluminum base provides direct contact with the heated surface, while the fins disperse the heat into the surrounding environment.
Heat is conducted away from the electronic device into the sink by an aluminum sheet that is placed between the device and the sink. This sheet provides a path for the heat to transfer from the component to the heat sink. Heat is then dissipated from the surface of the aluminum sheet into the air by the fins of the heat sink. This process is known as convection cooling.
The ATS-10H-159-C3-R0 is designed for small, confined spaces. Its low profile design makes it suitable for tight spaces. An integrated fan helps to dissipate heat in high-temperature environments, and the aluminum base and fins provide maximum thermal conductivity. The device also comes with a mounting clip, making installation straightforward.
The ATS-10H-159-C3-R0 is an excellent choice for cooling electronic components. Its small size and low profile design make it ideal for tight spaces, while its aluminum base and fins ensure maximum thermal conductivity. The integrated fan helps to dissipate heat in high-temperature environments, and the mounting clip makes installation easy. With its efficient cooling capabilities, the ATS-10H-159-C3-R0 is a great choice for any cooling application.
The specific data is subject to PDF, and the above content is for reference