ATS-10H-16-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.06°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are an important component of any cooling system and one of the most widely used products in electronics and semiconductor manufacturing processes. The ATS-10H-16-C1-R0 is a product of this category, designed to be used in various applications. This article will delve into the specifics of the ATS-10H-16-C1-R0, explaining its application field, and working principle.

Application Fields

The ATS-10H-16-C1-R0 heat sink is a general purpose thermal device, designed to provide increased heat dissipation in cooling solutions. This heat sink is primarily used in embedded systems, circuits, manufacturing processes, and other applications. It has a particularly outstanding performance-to-cost ratio, which makes it a popular choice for many applications.It is ideal for applications that require stable, low-temperature operation, such as controlling electronic components and controlling temperatures during efficient heat dissipation processes. This heat sink also offers stability in operation and low thermal resistance along with great affordability.

Working Principle

The ATS-10H-16-C1-R0 works through the principle of thermodynamics. Heat from the components is absorbed by the heat sink through conduction, and then released to the atmosphere through convection. The heat sink’s design allows heat to be quickly and effectively dissipated from the components.The ATS-10H-16-C1-R0 consists of three parts: a base, a heat spreader, and fins. The base is made of a highly thermal conductive material, such as aluminum. The top of the base is covered with a heat spreader made of thermally-conductive plastic. The fins are placed on the sides of the base and function as cooling fins, allowing heat to escape from the base.The heat is rapidly dissipated from the base to the surrounding air due to the thermal conductivity of the base and the natural convection of air. As heat diffuses outward and transfers to the cooling fins, the temperature of the heat sink decreases, allowing for optimal thermal performance.

Conclusion

The ATS-10H-16-C1-R0 is an effective thermal device that offers high performance at a very reasonable price. It is suitable for a wide range of applications, including cooling embedded systems and controlling temperatures during manufacturing processes. Its design enables it to quickly and effectively transfer the heat generated by components into the atmosphere through convection. The ATS-10H-16-C1-R0 is a valuable addition to any cooling solution, and is sure to provide excellent thermal performance.

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