| Allicdata Part #: | ATS-10H-16-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-16-C3-R0 |
| Price: | $ 4.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-16-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.73590 |
| 30 +: | $ 3.52842 |
| 50 +: | $ 3.32098 |
| 100 +: | $ 3.11340 |
| 250 +: | $ 2.90584 |
| 500 +: | $ 2.69828 |
| 1000 +: | $ 2.64639 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential components for designers creating a variety of electronic devices. The ATS-10H-16-C3-R0 is one component specifically designed for keeping heat sensitive components or areas cool. It does this by circulating air, or other fluids, over/through a conducting material, allowing the heat to dissipate into the environment.
This heat sink is designed for effective and efficient thermal management, particularly in electronics that utilise natural convection cooling. It is capable of handling up to 170 watts of cooling power and is recommended for both air and liquid cooling applications. The device features multiple fins which facilitate the circulation of air and/or liquid, allowing for more efficient cooling. The design also features three separate insert points which act as heat dissipators, to further improve the efficiency.
The ATS-10H-16-C3-R0 is typically used to cool enclosures, electronic components, and CPU’s, PCB\'s, and other heat sensitive components. It can also be used to lower system temperatures in order to improve performance and extend product life. The device boasts a small size and light weight, making it well suited for use in tight spaces and also for applications with limited space.
The ATS-10H-16-C3-R0 heat sink operates on a fan-less convection principle. With this model, the fins create turbulence as air passes over them, allowing the air to evenly distribute heat and dissipate across the entire product, instead of being concentrated on one spot. This helps maintain product reliability as it ensures constant cooling. The device also works in low-velocity environments, such as those found in many consumer devices, as it incorporates an aerodynamically designed scoop which helps to circulate air.
The device features a robust construction and is capable of withstanding temperature extremes and shocks. It is constructed from high quality zinc alloy and nickel plating for superior heat transfer and durability. This makes it an ideal choice for applications such as automotive and aerospace which are subjected to constant vibration and changing temperatures.
The ATS-10H-16-C3-R0 is an ideal solution for many applications requiring thermal management. It features a small size and light weight which makes it suitable for limited-space applications. It is also capable of handling up to 170 watts of cooling power and is well-suited for use in air and liquid cooling applications. It features an aerodynamic scoop which aids in air circulation, and multiple fins which facilitate the circulation of air and/or liquid, allowing for more efficient cooling.
The specific data is subject to PDF, and the above content is for reference