ATS-10H-168-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10H-168-C1-R0-ND

Manufacturer Part#:

ATS-10H-168-C1-R0

Price: $ 3.17
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X25MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10H-168-C1-R0 datasheetATS-10H-168-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.87721
30 +: $ 2.79909
50 +: $ 2.64361
100 +: $ 2.48812
250 +: $ 2.33264
500 +: $ 2.25488
1000 +: $ 2.02162
Stock 1000Can Ship Immediately
$ 3.17
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.94°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks or heat exchangers are components designed to transfer heat from one area to another, allowing for it to dissipate and be removed from the surface it is attached to. ATS-10H-168-C1-R0 is one such example and is a type of thermal-heat sink.

The ATS-10H-168-C1-R0 heat sink is designed to dissipate heat from electronics. It’s capable of sustaining high-voltage and current levels, meaning that it can handle temperatures up to 150⁰C for extended periods of time. It’s constructed with a finned aluminum extrusion, allowing for increased surface area and optimal air-flow to improve the efficiency of heat dissipation, meaning it can handle a higher load of heat.

The structural design of ATS-10H-168-C1-R0 heat sink features an array of fins, configuration of extruded fins with side-by-side ribs along the sides of the fins, enabling maximum heat dispersion from the device. The device offers great performance and quality in applications that require a low-profile and compact size. It is corrosion-resistant and offers superior thermal performance. The design includes solderable pins for mounting, which provide equal current distribution across the surface to ensure consistent cooling.

The primary application for the ATS-10H-168-C1-R0 heat sink is for power converters, such as in amplifiers, switchers, and rectifiers. It is also ideally suited for applications such as LED lights, LED displays, laser diodes, and other electronic devices that generate high heat.

The working principle of the ATS-10H-168-C1-R0 heat sink is based on the principle of thermal transfer. Any object, when heated, releases heat energy in the form of radiation or convection. In the case of the ATS-10H-168-C1-R0, heat is released in the form of convection, as air is forced through the fins and heated, causing a rise in temperature. This air, in turn, rises and is discharged from the surface of the heat sink, thus transferring the generated heat energy away from the device that is producing the heat.

The ATS-10H-168-C1-R0 heat sink is an efficient and effective way of dissipating heat from electronics. Its high-temperature capability and structurally designed array of fins make it a great choice for applications that require a reliable and low-profile heat sink.

The specific data is subject to PDF, and the above content is for reference

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