ATS-10H-175-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.65°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-Heat Sinks are widely used in a variety of industrial and commercial applications. In an application such as ATS-10H-175-C3-R0, the thermal-heat sink is used to dissipate the heat generated by electrical components, thereby improving system performance. This particular model is designed to fit within a small size application, making it an ideal choice for most applications.

Design and Construction

The ATS-10H-175-C3-R0 model is constructed of copper and aluminum with an anodized finish which provides corrosion resistance and durability. The fins provide a large surface area for the efficient transfer of heat. The copper base plate is machined to a smooth finish in order to reduce resistance against a heat transfer fluid such as oil or glycol. The fin material is also intentionally designed to maximize the surface area to enhance the thermal transfer of heat away from the components.

Heat Dissipation Principle

The ATS-10H-175-C3-R0 works on a principle known as thermal conduction. Thermal conduction is the process of transferring thermal energy from a material to another material due to temperature differences. Heat is transferred from the electrical components to the copper base plate and then out to the fins. This heat accumulation is opposed by a temperature gradient, or the transfer of heat from hot to cold materials. The thermal conduction process begins with the electrical components producing heat due to resistive electrical current. Heat is then transferred from the components to the copper base plate, where it is then conducted out through the fins. The aluminum fins provide a large surface area for the efficient transfer of heat away from the components.

Systems and Applications

The ATS-10H-175-C3-R0 is suitable for a variety of applications. It is often used as a cooling solution for electronic equipment in environments that are too hot for air-cooling solutions. It is also often used in servers, power supplies, and automotive and aerospace components. In industrial applications, it is used to dissipate the heat generated by pumps and motors, and can be used to create an efficient solution for heat exchange in cryogenic systems. In commercial applications, the ATS-10H-175-C3-R0 is often used to dissipate heat from air conditioners, refrigerators, and other household appliances.

Conclusion

The ATS-10H-175-C3-R0 model is a thermal-heat sink designed to fit within a small size application and is suitable for a variety of industrial and commercial applications. It works on a principle known as thermal conduction, in which heat is transferred from the components to the copper base plate and out to the fins. The aluminum fins provide a large surface area for the efficient transfer of heat away from the components. The ATS-10H-175-C3-R0 is a reliable and efficient heat sink and is ideal for a variety of applications.

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