
Allicdata Part #: | ATS-10H-177-C1-R0-ND |
Manufacturer Part#: |
ATS-10H-177-C1-R0 |
Price: | $ 3.52 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X20MM R-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.19788 |
30 +: | $ 3.11157 |
50 +: | $ 2.93857 |
100 +: | $ 2.76576 |
250 +: | $ 2.59291 |
500 +: | $ 2.50647 |
1000 +: | $ 2.24717 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 6.18°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an essential part of modern life. It is an integral part of the processing of electronic components and devices. Heat sinks are an important part of thermal management, helping to reduce the amount of heat produced by a given device or component. The ATS-10H-177-C1-R0 is one example of a heat sink engineered to meet the needs of a wide range of application fields and operating principles.
Introduction to ATS-10H-177-C1-R0
The ATS-10H-177-C1-R0 is a heat sink specifically designed for the processing of high power, high performance components. It is extremely effective at dissipating heat generated by components during operation. Its unique design allows it to maximize heat dissipation while minimizing the potential for damage to components or devices. The ATS-10H-177-C1-R0 is an ideal solution for the thermal management of high power components.
ATS-10H-177-C1-R0 Design
The ATS-10H-177-C1-R0 is designed using a combination of aluminum and copper construction. The design features three sets of aluminum fins that are connected to two copper plates. The aluminum fins increase the surface area of the heat sink, and the copper plates serve to maximize the thermal conductivity. As a result, the ATS-10H-177-C1-R0 is able to dissipate heat more effectively than most other heat sinks available on the market today.
The ATS-10H-177-C1-R0 also features a unique thermal management system. The heat sink is connected to a fan via a heat pipe. The fan is designed to move air across the heat sink, allowing it to dissipate heat more quickly and efficiently. This module ensures that the ATS-10H-177-C1-R0 heat sink is able to quickly and efficiently dissipate heat generated by components during operation.
Application Fields
The ATS-10H-177-C1-R0 heat sink is designed for a wide range of application fields. It is ideal for high power components that require quick and efficient heat dissipation. This includes CPUs, GPUs, and other high performance components. In addition, the heat sink can be used in a variety of other applications, such as laser diodes, power management systems, and other power electronics.
Working Principle
The ATS-10H-177-C1-R0 heat sink works by transferring heat from the components to the heat sink fins. The heat is then quickly dissipated into the surrounding environment by the fan. The thermal management system is designed to ensure that the components remain cool and that the heat is dissipated quickly and efficiently. This ensures that components remain in optimal condition during operation.
Conclusion
The ATS-10H-177-C1-R0 heat sink is an excellent solution for the thermal management of high power components. It is designed to offer superior thermal performance, while ensuring that components remain safe and in optimal condition during operation. The unique design of the heat sink allows it to effectively dissipate heat quickly and efficiently, and the thermal management system ensures that heat is dissipated quickly and efficiently. The ATS-10H-177-C1-R0 is ideal for a wide range of application fields and operating principles, making it a great choice for those looking for a reliable thermal management solution.
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