| Allicdata Part #: | ATS-10H-177-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-177-C3-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-177-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49335 |
| 30 +: | $ 3.29910 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.35°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Good thermal control is essential in equipment design and operation. The ATS-10H-177-C3-R0, a heat sink designed and manufactured by Advanced Thermal Solutions (ATS) to meet high thermal dissipation requirements, plays an important role in fulfilling this need.
ATS offers a line of heat sinks designed for a wide range of applications. The ATS-10H-177-C3-R0 is a pinned type heat sink with a square base and round pins optimized for cooling flat surfaces with a low pressure drop. It can be used in a variety of applications, from power converters and power amplifiers to high power lasers and LED lighting applications.
The heat sink consists of a single piece, aluminum extrusion cut into a uniform pattern of fins and pins. The aluminium is anodized and the pinhead is treated to improve corrosion resistance. The pin type construction allows higher thermal loads with lower air-flow restrictions than standard heat sinks. This allows for better cooling efficiency with less noise. The base design of the pins also helps to spread heat quickly away from the surface, making it suitable for applications with large contact area.
The ATS-10H-177-C3-R0 is designed to provide high thermal performance with low air velocity. Its shallow fins are optimized for a balanced airflow, allowing for increased heat transfer efficiency with minimal turbulence. The shallow fins also help to reduce acoustic noise, making the heat sink ideal for applications where noise pollution needs to be minimized. The optimized pinhead design also helps to reduce turbulence and air friction, further increasing the heat transfer efficiency.
The ATS-10H-177-C3-R0 consists of a thermally conductive aluminum base and an extruded heat sink profile optimized for the application. The heat sink is designed to operate without fans, but can also be used with fans for added performance. The heat sink is also designed to provide a tight fit, allowing for easy installation and minimizing the possibility of air gaps between the heat sink and the component.
The ATS-10H-177-C3-R0 is compatible with a wide range of components, including transistors, diodes, VCOs, relay circuits, high speed IGBTs, MOSFETs and other electronic components. The heat sink can also be used in conjunction with other cooling methods, such as liquid cooling or forced air cooling, for even greater thermal performance.
The ATS-10H-177-C3-R0 is an optimal solution for efficient heat dissipation in applications that require high power output with low thermal resistance. The well-designed heat sink provides excellent thermal performance, low acoustic noise and easy installation, making it an ideal choice for a broad range of applications.
The specific data is subject to PDF, and the above content is for reference