ATS-10H-178-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.95°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
Heat Sinks are components in the field of thermal management that are designed to dissipate heat away from electrical and electronic components. Heat sinks are used in applications ranging from computer hardware to medical devices to consumer electronics. The ATS-10H-178-C3-R0 is a heat sink from ATS Thermal Solutions that is designed specifically for high power applications and is suited for use with the application of gapless cold plates and cold plate systems that have an active cooling circuit. In this article, we will cover the application field and working principle of the ATS-10H-178-C3-R0.Application Field
The ATS-10H-178-C3-R0 is designed to dissipate heat away from components that generate high levels of heat, in high power applications. It is designed to support TEC (Thermo Electric Cooler) and combination TEC and heat sink application systems. The ATS-10H-178-C3-R0 is also designed to be used in equipment with active cooling applications such as computers or servers. Its optimized thermal performance facilitates uniform and efficient cooling of high power components. It comes with a long service life even in high power applications, and it is suitable for use with various types of materials including metals, plastic, and dielectrics.Working Principles
The ATS-10H-178-C3-R0 heat sink is designed to manage and dissipate heat away from components that generate higher levels of heat, in high power applications. The effective connectivity of the heatsink elements provides an efficient flow of heat away from the component and helps reduce the temperature of the component. By significantly improving the thermal performance of the system, the ATS-10H-178-C3-R0 heat sink can also help reduce the power consumption of the device, while still providing excellent performance and reliability.The heat sink works by dissipating heat away from the component using two types of processes: convection and radiation. In convection, heat is transferred between two bodies by means of thermal conduction. This means that as the heated air around the component rises, it is replaced with cooler air from below, which takes away the heated air and reduces the temperature. In radiation, the heat is transferred by means of electromagnetic waves. This process results in a transfer of energy that does not require the physical transfer of material from one place to another. This type of heat transfer is commonly used in high-power applications where convection may be insufficient as a cooling solution, as it provides a more efficient way of dissipating the heat to the surroundings. Conclusion
The ATS-10H-178-C3-R0 heat sink is specifically designed for high power applications and is suitable for use with applications where gapless cold plates and/or cold plate systems are used with an active cooling circuit. It helps dissipate heat away from components that generate high levels of heat, and can improve the thermal performance of the system while helping reduce the power consumption of the device. The ATS-10H-178-C3-R0 heat sink works by utilizing convection and radiation for the dissipation of heat, and is designed for a long service life even in high power applications.

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