ATS-10H-179-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.90°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are essential components that are used to protect sensitive parts in electronic components from overheating. Heat sinks are used in a range of applications, from controlling temperatures in CPUs and GPU cards to cooling laptop components and refrigerator coolers. One common type of heat sink is the ATS-10H-179-C1-R0, which is designed to dissipate heat from electrical components by transferring it into a cooler surrounding air.The ATS-10H-179-C1-R0 is a high-performance heat sink designed for applications that require a large heatsink in a confined space. The ATS-10H-179-C1-R0 is a finned aluminum heat sink that comes in two different versions – one with an integral 120mm fan, and one without. Both versions feature a 50mm fan housing, which provides improved cooling efficiency and increases airflow through the heatsink.The ATS-10H-179-C1-R0 is designed to provide superior thermal performance for a wide range of applications. For example, it is especially well-suited for cooling graphics cards, CPUs, power supplies, Peltier coolers, high-end hard drives, and other active components in electronics. The ATS-10H-179-C1-R0 heat sink is designed to mount quickly onto any device, and its mounting system is designed to be unobtrusive and reliable.The ATS-10H-179-C1-R0’s working principle can be broken down into two distinct stages. The first stage involves the efficient transfer of heat from the electronic components to the heat sink itself. due to its high thermal conductivity, aluminum is an ideal metal for transferring heat quickly. This process increases the temperature of the heat sink, creating a thermal gradient between the heated component and the cold air outside the case. In the second stage, a fan is used to force air through the heatsink’s fins. This cooling effect is achieved by the continuous motion of air, which pulls the warm air away from the components and expels it out of the case. This reduces the temperature of the heatsink and increases the overall efficiency of the cooling system.Heat sinks are essential components that are used in a wide range of electronic applications, from consumer electronics to industrial settings. The ATS-10H-179-C1-R0 is an example of a high-performance heatsink that is designed to maximize the thermal performance of sensitive devices while providing a flexible and reliable mounting system. Its two-stage heat transfer and fan system ensures that the device is cooled quickly and efficiently, making it an ideal choice for applications that require thermal protection from overheating.

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