| Allicdata Part #: | ATS-10H-179-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-179-C3-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-179-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technology has become increasingly important as electronic systems are expected to perform their applications more efficiently and reliably. Because of its many benefits, thermal management is now often used in a wide range of industrial, computing, and consumer-related applications.
The ATS-10H-179-C3-R0 is a specialized device designed for thermal management solutions. It is a two-stage, over-molded, heat sink with a combined total of 10 heat pipes and a total thickness of 179mm. It is designed to provide an optimized thermal environment for a variety of applications.
The ATS-10H-179-C3-R0 is suitable for applications requiring low to medium power levels and maximum thermal protection in a compact size. It is designed to regulate and dissipate heat generated by electronic components, ensuring that temperatures remain within safe margins and that the components operate correctly.
The ATS-10H-179-C3-R0 works on the principle of thermodynamics, using the process of heat conduction to transfer heat from the source of heat to the device. Heat is first conducted away from the source of heat and then dissipated by air or liquid cooling. The device also includes a fan to increase airflow and regulate the temperature of the device to ensure maximum efficiency.
The ATS-10H-179-C3-R0 is an ideal choice for controlling and preventing thermal runaway conditions, improving cooling performance and reliability, and providing a longer lifespan of the components. It is highly effective for a wide range of applications such as industrial and commercial machinery, computer and multimedia devices, CPUs, and power applications.
The device is also designed to be easy to install and maintain. It has universal mounting brackets and is compatible with a variety of cooling solutions. This allows it to be used in existing systems without disruption to existing systems. In addition, the device is designed to be highly efficient and reliable, requiring minimal maintenance.
The ATS-10H-179-C3-R0 is an excellent choice for thermal management solutions. Its easy installation and maintenance, along with its high performance and reliability, make it an ideal choice for any application where thermal management is a critical factor.
The specific data is subject to PDF, and the above content is for reference