| Allicdata Part #: | ATS-10H-181-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-181-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-181-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks seek to provide a surface on which heat can dissipate. This dissipated heat is transferred from a device or electronic component, to the sink, and to the surrounding environment. ATS-10H-181-C1-R0 is a type of thermal-heat sink.
This thermal-heat sink is designed to overcome medium-to-high-density heat dissipation issues caused by high current transistors and batteries. It is made from die-cast aluminum with a specially designed heat core and is designed with a height of 8mm and a maximum load of 3.7kg. ATS-10H-181-C1-R0 also has a thermal efficiency rating of 90.6%, making it highly efficient in dissipating heat.
The sink’s overall design offers maximum heat dissipation efficiency in a small area. The device also features a unique design with a huge dipolar radiation surface area. The increased area enables faster and larger capacity air flow to efficiently dissipate heat away from its heat core. This is further enhanced by its proprietary design that maximizes heat dissipating airflow support.
When using the ATS-10H-181-C1-R0 thermal-heat sink, it is important to maintain the right amount of thermal grease between its heat core and the target device. This is necessary for maximum heat dissipation. To ensure good contact between the two surfaces, the thermal grease should be applied evenly and at a consistent thickness.
Through its design, the ATS-10H-181-C1-R0 offers superior thermal performance, making it effective for removing heat from components such as high-current transistors and batteries. By conducting the heat away from these components, it can prevent them from overheating and ensure that they operate safely. This makes the ATS-10H-181-C1-R0 an ideal solution for various applications such as high-powered electronic equipment. It also has the capacity to transfer large amounts of heat when compared to other thermal-heat sinks.
Overall, the ATS-10H-181-C1-R0 thermal-heat sink is a highly efficient and cost-effective solution for dissipating heat from components or devices. By removing excess heat, it can help to ensure they operate safely and protect them from premature failure. The device is easy to install and requires minimal maintenance, making it an ideal choice for those seeking a reliable and effective thermal-heat sink.
The specific data is subject to PDF, and the above content is for reference