| Allicdata Part #: | ATS-10H-187-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-187-C3-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-187-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.79386 |
| 30 +: | $ 3.58323 |
| 50 +: | $ 3.37239 |
| 100 +: | $ 3.16159 |
| 250 +: | $ 2.95082 |
| 500 +: | $ 2.74005 |
| 1000 +: | $ 2.68736 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management of electronic devices is of great concern due to increasing power densities and miniaturization of components. Heat sinks provide an essential way of dissipating unwanted heat from electronic components, boards and housings. The ATS-10H-187-C3-R0 is a Heat Sink designed to help draw heat away from components through a process of conduction and convection. In achieving its purpose, this type of heat sink can provide thermal solutions for a variety of applications.
Design
The ATS-10H-187-C3-R0 heat sink is an attractive solution for a variety of thermal management needs. Its design features an aluminum extrusion-based construction, with a copper embed plate to facilitate superior thermal conduction. The copper insert containing the thermally conductive material is embedded into the aluminum extrusion body, offering an arrangement that is robust and reliable. The design is suitable for high leverage applications, as the shape of the unit can be adjusted easily. The ATS-10H-187-C3-R0’s compact size is ideal for applications where there is limited space.
Application Field
The ATS-10H-187-C3-R0 heat sink is suitable for a variety of application fields, depending on the needs and design of the electronic system at hand. Its construction means that it is well suited for semiconductor components, allowing draw heat away from the component and reduce temperature in a much more efficient manner. The ATS-10H-187-C3-R0 is also suited to a range of other components-including processors, microcontrollers, LED lights and FPGAs-which need careful thermal management.
Working Principle
Heat sinks use conductive and convective heat transfer mechanisms to provide thermal management solutions. With the ATS-10H-187-C3-R0, heat is conducted through the embedded copper insert and then released by the surrounding aluminum fin structure. This design promotes higher efficiency as compared to traditional air-cooled solutions. Furthermore, the fins provide an increase in surface area, allowing for more efficient thermal transfer to the surrounding environment. Finally, the device also contains several enlarged mounting holes, allowing for easy mechanical installation.
Conclusion
Overall, the ATS-10H-187-C3-R0 offers a great thermal management solution for a range of electronic applications. The unit is compact, allowing for easy installation, and its heat sink design provides great thermal transfer efficiency. With a combination of conductive and convective heat transfer, this heat sink can help protect components from overheating, improving their long-term performance. An important part of any electronic design, the ATS-10H-187-C3-R0 is a solid choice for a range of thermal management solutions.
The specific data is subject to PDF, and the above content is for reference