ATS-10H-189-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.82°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction:The ATS-10H-189-C3-R0 is an advanced thermal heat sink from the ATS series of thermal management solutions. It is designed for use in a wide range of applications, including electronics cooling, power electronics cooling, gaming cooling, and many other applications. This heat sink has been built with proprietary thermal management technology that provides superior performance in demanding environments. This article will discuss the application field and working principle of the ATS-10H-189-C3-R0.

Application Field:

The ATS-10H-189-C3-R0 heat sink is designed to provide cooling solutions for a variety of applications, such as electronics cooling, power electronics cooling, gaming cooling, and more. It is ideal for applications where high efficiency and performance are required. The thermal management technology used in the ATS-10H-189-C3-R0 ensures that the device operates at a lower temperature than other conventional heat sinks, ensuring that the heat generated by the components does not have an adverse effect on performance.

Working Principle:

The ATS-10H-189-C3-R0 operates on the principle of high-speed thermal conduction. The device is constructed from an advanced patented aluminum alloy, which has a high thermal conductivity. This alloy ensures that heat generated by the components is effectively dissipated across the entire surface of the heat sink.The ATS-10H-189-C3-R0 also utilizes a proprietary heat dissipation design. This design ensures that heat generated by the components is quickly and efficiently conducted away from the device. This ensures that the device operates at a lower temperature than other conventional heat sinks, allowing for efficient cooling of components. Furthermore, the device also features a sealed chamber, which helps to prevent the contamination of dust and other particles. This helps to ensure that the performance of the device is not affected by these particles.

Conclusion:

The ATS-10H-189-C3-R0 thermal heat sink is an advanced device designed for a wide variety of applications. It has been designed to provide superior cooling solutions, with its proprietary thermal management technology and high thermal conductivity aluminum alloy ensuring that components are effectively cooled. Furthermore, the device also features a sealed chamber, which helps to prevent the contamination of dust and other particles. This makes the ATS-10H-189-C3-R0 an ideal solution for applications where high efficiency and performance are required.

The specific data is subject to PDF, and the above content is for reference