| Allicdata Part #: | ATS-10H-190-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-190-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-190-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a type of component used for cooling various electronic devices, such as CPUs, GPUs, microprocessors, and memory chips. Heat Sinks are used to transfer heat away from the device, thus cooling it and improving its performance. One such device is the ATS-10H-190-C1-R0 Heat Sink.
The ATS-10H-190-C1-R0 is a particularly efficient and robust heatsink, designed for applications that require a higher thermal performance than most other Heat Sinks. It is constructed from anodized aluminum and features a fin density of 161 fpi (fins per inch), a fin width of 0.125”, and a fin height of 0.49”. As a result, the ATS-10H-190-C1-R0 has a remarkably high capacity for thermal transfer.
In terms of its application fields, the ATS-10H-190-C1-R0 can be used in many different industries. It is commonly used in areas such as aerospace, automotive, medical, and consumer electronics. In terms of particular uses, it is most often used to help cool devices such CPUs, GPUs, and memory chips, as well as in the regulation and cooling of LED lighting and solar cells. It can also be employed in cooling towers, as well as in refrigeration and air conditioning units.
The ATS-10H-190-C1-R0 Heat Sink operates on a thermal-diffusion principle, which works by transferring heat from its surface to the atmosphere via radiation, conduction, and convection. This process utilizes a heat spreading process to ensure efficient heat transfer. The ATS-10H-190-C1-R0 is also fitted with an integrated fan, which helps to dissipate heat quickly and effectively, cooling the device more effectively than if the fan were left out.
The ATS-10H-190-C1-R0 is a highly efficient, robust, and versatile Heat Sink, ideally suited for cooling a wide variety of electronic devices and appliances. Its efficient thermal transfer and integrated fan make it an excellent solution for a wide range of applications, from cooling CPUs and LEDs, to refrigeration and air conditioning units. With its high quality construction and superior performance, the ATS-10H-190-C1-R0 is an invaluable asset in the thermal management of devices in various industries.
The specific data is subject to PDF, and the above content is for reference