| Allicdata Part #: | ATS-10H-193-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-193-C3-R0 |
| Price: | $ 3.30 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-193-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.99565 |
| 30 +: | $ 2.91480 |
| 50 +: | $ 2.75285 |
| 100 +: | $ 2.59094 |
| 250 +: | $ 2.42903 |
| 500 +: | $ 2.34806 |
| 1000 +: | $ 2.10516 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
ATS-10H-193-C3-R0 thermal heat sinksare some of the most efficient heat management components on the market today. Heat sinks are widely employed in electronics cooling to transfer heat generated by high power devices, typically microchips, off of the semiconductor substrate and into the sink, which then dissipates the heat into the ambient.
Application
ATS-10H-193-C3-R0 thermal heat sinks have a wide range of applications. They are typically used by manufacturers of consumer electronic products, such as computers, televisions and other devices. It is also often employed in industrial applications, such as in high-power lasers, MRI machines, as well as in optical equipment. ATS-10H-193-C3-R0 thermal heat sinks are also helpful in a number of military and aerospace applications, such as in cooling large transistors and other high-power components.
Advantages of ATS-10H-193-C3-R0 Heat Sinks
ATS-10H-193-C3-R0 thermal heat sinks have a number of advantages over traditional aluminum heat sinks. Heat sinks are designed to be lightweight, while still providing excellent heat dissipation characteristics. They are also typically much simpler to install than traditional aluminum heat sinks, and require much less maintenance. They also have a wide temperature range so that they can be used in a variety of different applications. Additionally, ATS-10H-193-C3-R0 thermal heat sinks require no soldering or joint construction, meaning that there is very little risk of develhting or instability during installation.
Working Principle
The working principle of ATS-10H-193-C3-R0 thermal heat sinks is quite simple. Heat sink materials, such as aluminum, have high thermal conductivity. The surface of the heat sink is designed to be as efficient as possible in dissipation of the generated heat. This heat is then transferred from the heat sink device to the ambient air, and eventually dissipates into the surrounding environment. The thermal conductivity of the material used to construct the heat sink significantly affects the heat sink\'s ability to dissipate heat.
Conclusion
ATS-10H-193-C3-R0 thermal heat sinks are an efficient and reliable way to dissipate heat in electronics components. They are easy to install and require little maintenance. They have a wide range of applications, such as consumer electronics, industrial machines, military/aerospace components, as well as many others. The working principle behind ATS-10H-193-C3-R0 thermal heat sinks makes use of the high thermal conductivity of aluminum and other similar materials to help quickly and effectively dissipate heat.
The specific data is subject to PDF, and the above content is for reference