ATS-10H-195-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.12°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Article

Thermal - Heat Sinks

Thermal management is an essential element in almost every system, including electronic devices, computers, and other systems that generate heat. Heat sinks are one of the most common methods of dissipating heat. They are used in a wide range of applications, ranging from cooling small-scale consumer electronics to larger, industrial-scale systems. The ATS-10H-195-C3-R0 is a popular type of heat sink that is designed to effectively dissipate heat from electronic devices and other components.

ATS-10H-195-C3-R0 Application Field

The ATS-10H-195-C3-R0 is designed to dissipate heat from electronic components, such as processors and other semiconductor devices. It is well suited for applications where space is limited, due to its low profile construction and thin profile. It is suitable for cooling applications in a variety of industries, including consumer electronics, computing, and industrial systems. The ATS-10H-195-C3-R0 is also commonly used in automotive applications, such as on the exterior of engine blocks and exposed components.

ATS-10H-195-C3-R0 Working Principle

The ATS-10H-195-C3-R0 uses a combination of design elements to effectively dissipate heat. It features a series of aluminum fins that are designed to increase the surface area and improve the dissipation of heat. The fins are also designed to maximize airflow over the surface of the heat sink, allowing for more efficient cooling. The ATS-10H-195-C3-R0 also incorporates a copper heat spreader that is designed to further dissipate heat from the device or component.The ATS-10H-195-C3-R0 is designed to be installed directly onto a processor or other power-resource intensive component. The heat sink is mounted using special screws that are designed to ensure a secure connection to the component. A thermal interface material is often used in conjunction with the ATS-10H-195-C3-R0 to further improve the efficiency of heat transfer. The thermal interface material is designed to fill any gaps or irregularities on the surface of the component being cooled to ensure maximum thermal transfer.

Conclusion

The ATS-10H-195-C3-R0 is designed to be a highly effective heat sink solution for a wide variety of electrical components and systems. It is designed to dissipate heat through the use of aluminum fins, copper heat spreaders, and thermal interface materials. The ATS-10H-195-C3-R0 is well suited for applications where space is limited and where efficient heat dissipation is required. It is an excellent choice for systems that require reliable cooling in harsh environments and that require minimal maintenance.

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