ATS-10H-20-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-10H-20-C3-R0 is a heat sink designed for use in thermal management applications. It\'s a powerful solution for heat dissipation, dissipating both generated heat from components as well as preventing the spread of generated heat from one component to another. Heat sinks are typically constructed of aluminum or copper and act as thermal pockets, capturing generated heat and releasing it to the air. Heat sinks can be used with both active and passive cooling systems, and they can be customized and configured to meet the needs of the application.

Application Field

The ATS-10H-20-C3-R0 has a range of applications in the thermal management field. It can be used to cool thermal components such as processors, CPUs, GPUs, and other integrated circuits. Additionally, it can be used to control system temperature, protect electronic components from over-heating, and improve system reliability. It is well suited for applications where space is at a premium, such as in laptops and tablets, as well as outdoor applications such as in telecommunications systems.

Working Principles

Heat sinks work by increasing the surface area of a component and thereby increasing the rate at which heat dissipates from the component. The ATS-10H-20-C3-R0 is a highly efficient heat sink, featuring a combination of soft fins and bonded fins for maximum heat dissipation. Its thin profile allows it to fit in tight spaces while still providing optimal cooling. It also has a flat bottom that ensures a tight fit against the component it is cooling.Heat sinks are constructed in a way that allows air to circulate freely around the component. This is achieved through a combination of cross cutting, beveling, and other techniques. The resulting fins can be arranged to either pull or push air, depending on what type of cooling is desired. In addition, the fins can be angled in ways that facilitate air circulation.The ATS-10H-20-C3-R0 can be mounted in either horizontal or vertical positions. It can be used with a variety of cooling systems, such as traditional air cooling, liquid cooling, or a combination of both. In addition, the heat sink can be used with an airflow assist, which uses a fan to increase heat dissipation.

Conclusion

The ATS-10H-20-C3-R0 is a powerful thermal management solution, offering high levels of heat dissipation. It is ideal for applications where space is at a premium, as its thin profile allows it to fit in tight spaces. Its efficient heat dissipation and adjustable fins make it well suited for a wide range of cooling applications. It is a great choice for cooling components such as processors, GPUs, and other integrated circuits.

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