| Allicdata Part #: | ATS-10H-200-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-200-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-200-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45933 |
| 30 +: | $ 3.36588 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions are essential components of a variety of electronic components in order to ensure the efficiency and proper functioning of these devices. A particular type of thermal solution is known as ATS-10H-200-C3-R0, and this article will discuss the application fields and working principles of this product.
Firstly, ATS-10H-200-C3-R0 is a type of heat sink, which is used to dissipate heat from electronic components in order to increase their efficiency and control their internal temperatures. This type of heat sink is a flat plate aluminum framework with fins, which are designed to provide increased surface area and therefore allow for more efficient heat dissipation. This heat sink is particularly well-suited for applications in a variety of electronic components, from power supplies to processors and audio devices.
The working principle of ATS-10H-200-C3-R0 is quite simple. Heat is generated when electrons move within an electronic component, and this heat must be dissipated in order to prevent any thermal damage or failure. The fins in the heat sink act as a radiator, helping to disperse the heat from the electronic component to the surrounding environment. The fins also allow for the heat to be spread out over a larger area, which in turn allows for more efficient cooling.
In addition to its use as a heat sink, ATS-10H-200-C3-R0 can also be used in combination with a fan in order to provide even better cooling. By using a fan in conjunction with this heat sink, the air flow over the fins increases, allowing for even more efficient heat dissipation. This allows for higher powered electronic components to be used without the worry of overheating.
The ATS-10H-200-C3-R0 is an effective and reliable heat sink solution for a variety of electronic components. Its aluminum build ensures high heat transfer efficiency and allows for better control of internal temperatures. The fins provide increased surface area for more efficient heat dissipation, particularly when used together with a fan. This makes it an ideal choice for a variety of applications, ranging from power supplies to processors and audio devices.
The specific data is subject to PDF, and the above content is for reference