ATS-10H-201-C1-R0

Heat sinks are generally made of aluminum or copper, and are designed to dissipate thermal energy when an electronic or mechanical device produces heat. Heat sinks are available in many shapes and sizes and are used in many different applications. The ATS-10H-201-C1-R0 heat sink is one of the most popular models used today for high performance electronics systems. It is designed to provide an integrated solution for cooling products without generating additional noise.

The ATS-10H-201-C1-R0 product combines a thermal interface pad with a finned aluminum heat sink for maximum cooling efficiency. It has an all metal design with a black anodized surface that helps to reduce emissivity and optimize airflow. The product measures 200mm tall, 98mm wide and 93mm deep, with a varied fin spacing that helps to optimize the airflow rate. The design is rated for up to 0.22 mm of air gap.

The ATS-10H-201-C1-R0 is designed for cooling applications in a variety of electronic systems, including power electronics, computers, industrial equipment, and communication systems. It can be used in both air- and liquid-cooled systems, and can be used for both direct and indirect cooling. The product is designed for long life and is UL certified for safety. It is also RoHS 3 compliant, for peace of mind.

The ATS-10H-201-C1-R0 works by dissipating heat away from electronic components, as well as from other heat sources. The large surface area of the finned aluminum heat sink helps to spread the heat into a larger area, which improves the cooling effect. The heat sink also distributes the heat evenly across its surface and due to its optimized fin design, is capable of dissipating up to 255 watts of thermal energy. In addition, the product is designed to provide a low thermal resistance when used in applications that require a higher power density. Furthermore, the product is capable of working with both standard and high-temperature materials.

The ATS-10H-201-C1-R0 also includes a high-performance thermal transfer pad, which helps to enhance the cooling efficiency of the heat sink by providing a thermal barrier between the device and the thermal interface pad. The pad is designed to reduce thermal resistance and to reduce the heat generated by the device. It is also designed to reduce the risk of thermal fatigue, which can occur when the heat from the device is not dissipated quickly enough. In addition, the product offers a high degree of longevity and reliability, especially when used with power electronics or high-temperature components.

The ATS-10H-201-C1-R0 is an ideal solution for cooling a variety of electronic systems, and its integrated solution offers a superior cooling performance with low thermal resistance. It is designed for long-term operation and is UL certified for safety and RoHS 3 compliant. The product is designed for both direct and indirect cooling and is capable of dissipating up to 255 watts of thermal energy. The ATS-10H-201-C1-R0 is perfect for a variety of cooling applications, and its integrated thermal interface pad helps to ensure maximum cooling efficiency.