| Allicdata Part #: | ATS-10H-203-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-203-C3-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-203-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.04°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are widely used in a variety of computing, cooling and industrial settings, and can offer superior performance compared to other types of thermal management products. The ATS-10H-203-C3-R0 is an ideal solution when it comes to heat sink applications.
The ATS-10H-203-C3-R0 is a heat sink in a compact form factor that is specifically designed to offer optimal thermal performance. It was built with a compact, lightweight design, so it can fit in a variety of tight spaces, and its aluminum alloy construction gives it a robust form that can withstand extreme temperatures and pressures. In addition, the ATS-10H-203-C3-R0 has a black anodized finish, which helps increase its strength and durability. This heat sink also features advanced thermal management technology, which includes a copper base plate, direct heat pipes and a high-efficiency fan system.
As far as its application field, the ATS-10H-203-C3-R0 heat sink is well-suited for a wide range of applications, including CPUs, GPUs, and memory modules. It can also act as a heatsink for high-end audio and video board components, as well as high-end portable electronic devices. Additionally, it can help lower the temperatures of servers and other IT equipment, as well as their immediate environment.
In terms of working principle, the ATS-10H-203-C3-R0 takes heat away from the component it is attached to by using its direct heat pipe technology. This technology uses heat pipes that are directly attached to the component to draw heat away from the component and transfer it into the heat sink base plate. This allows the heat sink to draw away from the component, cooling it significantly. This process is further enhanced by the high-efficiency fan system, which helps to remove the heat generated from the component. This fan system also helps to regulate the temperature of the component, Cooler- and maintain a stable temperature within the application.
The ATS-10H-203-C3-R0 is a robust heat sink that provides superior thermal performance and can help increase the reliability of a wide range of applications. It is a great choice for anyone looking for a reliable and efficient thermal solution. The ATS-10H-203-C3-R0 is the ideal choice for a variety of applications in need of thermal management solutions.
The specific data is subject to PDF, and the above content is for reference