| Allicdata Part #: | ATS-10H-23-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-23-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-23-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction to the ATS-10H-23-C3-R0 Thermal - Heat Sink
The ATS-10H-23-C3-R0 thermal - heat sink is designed to offer efficient cooling and superior thermal control for a wide variety of electric and electronic components. It is capable of dissipating large amounts of heat and keeping electronic components at specific temperatures for extended periods of time. The ATS-10H-23-C3-R0 is a versatile and reliable thermal solution for a variety of applications.
Application Field of ATS-10H-23-C3-R0 Thermal - Heat Sink
The ATS-10H-23-C3-R0 thermal - heat sink is widely used in a variety of industries. It is perfect for cooling and dissipating heat from the power supply in computers, communication equipment, automotive electronics, industrial automation and audio equipment. It is also used in high-density integrated circuits boards, where precision heat control is needed. The ATS-10H-23-C3-R0 thermal - heat sink is also used in military and aerospace applications because of its superior performance.
Working Principle of ATS-10H-23-C3-R0 Thermal - Heat Sink
The ATS-10H-23-C3-R0 thermal - heat sink has an extruded heatsink that is made from advanced aluminum alloy. It is designed to ensure high thermal transfer across the whole surface area of the dissipater. The extruded aluminum finned surface allows for the most efficient air convection and strong heat dissipation capabilities. The hole pattern of the base ensures rapid heat dissipation from the device to the fins of the ATS-10H-23-C3-R0 thermal - heat sink. The fins are designed to expose a large part of the dissipating surface to the air-flow while extracting heat away from the component.
The ATS-10H-23-C3-R0 thermal - heat sink is highly efficient at dissipating large amounts of heat generated from electronic components. This is achieved through a combination of advanced material science, geometry optimization, and intuitive design. The ATS-10H-23-C3-R0 thermal - heat sink uses an innovative thermally-conductive design and proprietary geometry to maximize air circulation and maximize heat transfer rate. This ensures that the component is kept cool, even when exposed to extreme workloads.
Conclusion
The ATS-10H-23-C3-R0 thermal - heat sink is a versatile and reliable solution for cooling and dissipating heat from electronic components. It is perfectly designed to protect components from heat damage, and is suitable for a wide variety of applications, including in computers, communication equipment, industrial automation, and military and aerospace applications. The ATS-10H-23-C3-R0 is an efficient and reliable solution for dissipating heat and maintaining a precise temperature environment.
The specific data is subject to PDF, and the above content is for reference