ATS-10H-30-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-10H-30-C3-R0-ND

Manufacturer Part#:

ATS-10H-30-C3-R0

Price: $ 8.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10H-30-C3-R0 datasheetATS-10H-30-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 7.31934
30 +: $ 6.88861
50 +: $ 6.45813
100 +: $ 6.02759
250 +: $ 5.59705
500 +: $ 5.48941
1000 +: $ 5.38177
Stock 1000Can Ship Immediately
$ 8.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.35°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management plays an important role in ensuring safe and efficient operation of modern electronics. Heat sinks are vital components in many electronic devices, as they help remove heat from the components, improving performance and reliability while maintaining a safe operating temperature. The ATS-10H-30-C3-R0 is a high-end heat sink designed to provide excellent thermal management at a competitive price. This article looks at the heat sink’s application field and working principle.

Applications

The ATS-10H-30-C3-R0 is designed for use in a wide range of applications, from consumer electronic applications and automotive applications to industrial grade components in harsh environments. The heat sink is suitable for mounting on PCBs of both large and small sizes, as it measures just 30mm in diameter. This makes it an ideal choice for applications with space constraints.

Its efficiency in removing heat also makes it suitable for use in much higher levels of power dissipation than other heat sinks. It can dissipate up to 10 Watts of heat without affecting its performance, making it a viable solution for more powerful applications such as servers and graphics cards. Furthermore, the heat sink has an adjustable mounting, so it can be used in a variety of setups.

Working Principle

The ATS-10H-30-C3-R0 heat sink uses a combination of convection and natural convection to achieve effective and efficient heat dissipation. Convection is the process of transferring heat from one place to another through the movement of fluids, such as air or water. Natural convection is the same phenomenon, but without any forced movement of the fluid.

In the ATS-10H-30-C3-R0, heat is transferred from the component to the heat sink using forced convection. A fan inside the heat sink blows air over the heat sink fins, which are made of aluminum. The heat is absorbed by the fins, which are engineered to have high surface area. The air circulates over the fins, carrying the heat away with it.

At the same time, the natural convection helps to further dissipate the heat. Heat rises up from the heat sink and is displaced from the system by the fan, creating a continuous cycle of cooling. This makes the ATS-10H-30-C3-R0 a highly efficient choice for removing a large amount of heat with minimal noise.

Conclusion

The ATS-10H-30-C3-R0 heat sink is a great solution for any application that needs reliable and efficient thermal management. Its small size makes it suitable for cramped situations, while its excellent heat transfer capabilities make it a viable option for more powerful applications. Its combination of forced convection and natural convection ensures that it can handle a wide variety of thermal loads without compromising performance or reliability.

The specific data is subject to PDF, and the above content is for reference

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