| Allicdata Part #: | ATS-10H-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-10H-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important components of electronic devices that are used to disperse the heat generated by the components within the device. The ATS-10H-32-χ2-R0 Heat Sink is an up-to-date, energy-efficient heat sink that is designed to reduce the amount of heat generated and improve the overall performance of the device. This innovative heat sink is designed to be used in a variety of applications, and its working principle is simple yet effective.
ATS-10H-32-χ2-R0 Application Field
The ATS-10H-32-χ2-R0 Heat Sink can be used in many types of applications, such as industrial electronics, medical electronics, military electronics, and automotive electronics. It is designed to be used in applications where there is a need for efficient cooling and heat dissipation. The heat sink can also be used in cooling systems such as fans and air-conditioning systems.
The heat sink can also be used in computers, where it is specifically designed to remove the heat generated by system components. With its efficient design, the ATS-10H-32-χ2-R0 can help reduce the temperature of components and extend their life cycle. It can also be used in other systems such as networking and telecommunications, where heat dissipation is key in preventing system malfunctions.
Working Principle
The ATS-10H-32-χ2-R0 Heat Sink is designed using a heat-sinking principle. It is made up of an aluminum alloy base and a thin fin, which is made from copper. This design is intended to maximize heat dissipation without adding bulk or excess weight. The innovative design of the heat sink is able to quickly disperse the heat produced by the components, thus keeping the device from overheating.
The heat sink works by creating a surface area that is larger than the component that is being cooled. This allows the heat to spread out over a wider area, thus preventing it from accumulating in any single area. This ensures that the component does not exceed its maximum temperature, thus protecting the device from any damage caused by overheating.
Additionally, the fin is designed to be able to conduct heat directly to the heat sink, allowing it to transfer the heat away from the component quickly. This ensures that the heat is dissipated effectively without dissipating too much energy as well.
The overall effectiveness of the ATS-10H-32-χ2-R0 heat sink is further enhanced by the use of an advanced heat-spreading technology. This technology helps to evenly spread the heat away from the component, allowing the device to remain at a safe and stable temperature.
Conclusion
The ATS-10H-32-χ2-R0 Heat Sink is a modern, efficient, and lightweight heat management solution. It is designed to be used in a variety of applications and its working principle ensures that it can efficiently manage increased temperatures. With its advanced heat-spreading technology, the device can easily disperse the heat away from components, thus ensuring that the device works at optimal performance.
The specific data is subject to PDF, and the above content is for reference