
Allicdata Part #: | ATS-10H-33-C1-R0-ND |
Manufacturer Part#: |
ATS-10H-33-C1-R0 |
Price: | $ 5.41 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 57.9X36.83X17.78MM |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.86990 |
30 +: | $ 4.59900 |
50 +: | $ 4.32860 |
100 +: | $ 4.05802 |
250 +: | $ 3.78748 |
500 +: | $ 3.51695 |
1000 +: | $ 3.44932 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Rectangular, Fins |
Length: | 2.280" (57.90mm) |
Width: | 1.450" (36.83mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.700" (17.78mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 17.40°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Heat sinks are essential components in a range of everyday devices such as electronics and mechanical systems. The ATS-10H-33-C1-R0 is an advanced heat sink that excels in a variety of applications, from computing to telecommunications. This article outlines the various purposes served by ATS-10H-33-C1-R0 heat sinks and its working principles.
The ATS-10H-33-C1-R0 are a type of heat sink designed for use in high-temperature environments. These heat sinks are made from a combination of copper and aluminum materials that are designed to provide long-term reliability. The design of these heat sinks eliminates the need for fans, allowing for a more efficient cooling system and improved noise levels.
The ATS-10H-33-C1-R0 heat sinks can be used in a variety of electronic and mechanical systems. In electronics, the advanced heat sink design is ideal for applications such as system power supplies, power converters, and signal processing products. In the field of mechanical engineering, the ATS-10H-33-C1-R0 heat sinks can be used for applications such as spindles, motors, and other machinery.
The design of the ATS-10H-33-C1-R0 heat sink is comprised of two layers. The first layer is a solid aluminum base that provides a platform for the copper fins. The copper fins are then attached to the aluminum base and provide increased surface area for the cooling process. This design of copper and aluminum creates a large surface area that efficiently absorbs and dissipates heat.
The ATS-10H-33-C1-R0 is designed to provide efficient heat dissipation without the need for a fan. The heat sink relies on convection cooling, which draws in air from the surrounding environment and allows it to flow through the fins. As the air passes through the fins, the increased surface area of the copper and aluminum materials efficiently absorbs and transfers the heat away to the surrounding environment.
The ATS-10H-33-C1-R0 heat sink has a wide range of applications, from computing to telecommunications. By providing efficient cooling without the need for a fan, these heat sinks are ideal for use in electronics in need of sustained performance or in large, integrated systems. In the field of mechanical engineering, these advanced heat sinks are also beneficial for operations or machinery that need to be kept at a consistent temperature.
The ATS-10H-33-C1-R0 heat sink is an essential component in a variety of electronic and mechanical systems. The design of the copper and aluminum materials not only provides a large surface area for efficient cooling but also eliminates the need for fans. This makes the ATS-10H-33-C1-R0 an ideal choice for applications in large, integrated systems or machinery that need to be kept at an even temperature. By providing efficient heat dissipation, these heat sinks are an invaluable component in the functioning of a range of everyday devices.
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