| Allicdata Part #: | ATS-10H-41-C2-R0-ND |
| Manufacturer Part#: |
ATS-10H-41-C2-R0 |
| Price: | $ 6.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-41-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.16518 |
| 30 +: | $ 5.82267 |
| 50 +: | $ 5.48012 |
| 100 +: | $ 5.13759 |
| 250 +: | $ 4.79508 |
| 500 +: | $ 4.45257 |
| 1000 +: | $ 4.36695 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks
A thermal – heat sink is a device used to dissipate heat away from an electronic component, typically integrated circuits, processors or transistors. Heat sinks can come in a variety of shapes and sizes, designed to fit a variety of different applications and purposes. One example of a thermal – heat sink is the ATS-10H-41-C2-R0.
ATS-10H-41-C2-R0 Application Field and Working Principle
The ATS-10H-41-C2-R0 is a highly reliable, high temperature-resistant thermal – heat sink that offers excellent heat dissipation capabilities. It is designed for use in areas that require higher radiating temperatures and can be used for both direct heating and cooling purposes. Applications for this heat sink range from semiconductor packaging to medical equipment, laser and lightening, automotive industry, and high-reliability military equipment.
The ATS-10H-41-C2-R0 consists of an aluminum base plate, a copper top plate and an aluminum fins structure. The aluminum base plate acts as a stable bed for mounting, while the copper top plate helps to dissipate the heat away faster and more efficiently by conducting to the aluminum fins and acting as a large thermal surface area. The aluminum fins are designed with air-flow tunnels technologies to ensure maximum heat conduction from the base plate, copper top plate and aluminum fins to the surroundings. The purpose of this design is to increase the heat transfer area and to allow air to flow freely between the fins, thus efficiently dissipating heat from the device.
The ATS-10H-41-C2-R0 also features a built-in fan and thermal paste, which work together to further increase the heat transfer rate and ensure stable temperature control. The fan keeps fresh air flowing, thus promoting the transfer of heat away from the device. The thermal paste acts as an insulator, preventing heat from transferring back to the device or back to other components. This combination of techniques makes the ATS-10H-41-C2-R0 an extremely efficient, reliable and cost-effective cooling solution.
In short, the ATS-10H-41-C2-R0 is a high reliability, high temperature-resistant thermal – heat sink that provides excellent heat dissipation capabilities. Its aluminum base plate and copper top plate offer increased heat conduction, while the built-in fan and thermal paste work together to ensure steady temperature control. With its wide range of applications, from semiconductor packaging to high-reliability military equipment, the ATS-10H-41-C2-R0 is a great choice for any application that demands reliable heat dissipation.
The specific data is subject to PDF, and the above content is for reference