ATS-10H-47-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-10H-47-C1-R0-ND

Manufacturer Part#:

ATS-10H-47-C1-R0

Price: $ 3.65
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X30MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-10H-47-C1-R0 datasheetATS-10H-47-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.31695
30 +: $ 3.22707
50 +: $ 3.04781
100 +: $ 2.86858
250 +: $ 2.68930
500 +: $ 2.59965
1000 +: $ 2.33071
Stock 1000Can Ship Immediately
$ 3.65
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.24°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management is an important part of any electronic system or component. Heat sinks are one type of thermal management device used to lower and regulate the temperature of electronic components, helping to prevent system failure and component damage due to overheating. The ATS-10H-47-C1-R0 is a type of heat sink specifically designed to be used in thermal management systems.

The ATS-10H-47-C1-R0 heat sink is made from extruded aluminum, which is one of the most common materials used for heat sinks. The inner mounting holes are 0.197-inch in diameter and the outside size is 1.77-inch x 1.02-inch x 0.43-inch. The thermal resistance of the ATS-10H-47-C1-R0 is 0.27°C/W, allowing it to draw heat away from components quickly and efficiently. The maximum power density of this device is 10 watts.

The ATS-10H-47-C1-R0 is typically used in avionics and electronic applications that need to keep their components at a safe temperature. This device can handle a wide range of temperatures, ranging from -45°C to 150°C, and can be used in both indoor and outdoor environments. It is designed to be used with high frequency and low voltage applications, and is compatible with a variety of different components, including transistors, amplifiers, and electric motors. The ATS-10H-47-C1-R0 also features an optimized fin design to increase the surface area available to draw heat away from components.

This heat sink is specifically designed to provide a reliable, cost-effective solution for thermal management requirements. The aluminum construction means it is durable and able to withstand highly-demanding conditions, while the optimized fin design increases its effectiveness at drawing heat away from components. Additionally, the ATS-10H-47-C1-R0 is lightweight and easy to install, making it a great choice for applications where weight or space constraints are an issue.

The ATS-10H-47-C1-R0 heat sink works by dissipating heat away from components. This is achieved through the process of conduction, in which heat is transferred from one object to another. In the case of the ATS-10H-47-C1-R0, the heat is transferred from the electronic components to the fins of the heat sink, and then to the environment. This process of drawing heat away from the components helps to regulate its temperature and prevent failure or damage caused by overheating.

The ATS-10H-47-C1-R0 heat sink is an excellent option for any electronic applications that require reliable thermal management solutions. Its aluminum construction makes it durable and able to withstand a wide range of temperatures, while its optimized fin design provides increased effectiveness at drawing heat away. This makes it an ideal solution for any application or environment that needs to keep its components operating at a safe temperature.

The specific data is subject to PDF, and the above content is for reference

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