| Allicdata Part #: | ATS-10H-53-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-53-C1-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-53-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44736 |
| 30 +: | $ 3.35433 |
| 50 +: | $ 3.16802 |
| 100 +: | $ 2.98166 |
| 250 +: | $ 2.79531 |
| 500 +: | $ 2.70213 |
| 1000 +: | $ 2.42260 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.52°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important mechanical components for dissipating heat generated by electronic components. The ATS-10H-53-C1-R0 is a type of heat sink designed for cooling high-power applications with high temperature environments. This heat sink is manufactured with an improved pin-fin type feature, allowing it to provide better cooling and greater reliability than other available thermal solutions.
The ATS-10H-53-C1-R0 is designed for applications with operating temperatures of up to 200°C (392°F). It is a highly reliable and cost-effective solution for dissipating the heat generated by high-power electronics. The integrated curved pin-fin design improves the heat dissipation ability and longevity of the system. This design feature also allows for enhanced air flow and more efficient cooling.
This thermal solution is made of a high-grade aluminum alloy (6063-T5) which allows for increased strength and durability. The material is optimized with a heat-treated surface for improved surface smoothness and a better surface finish. The ATS-10H-53-C1-R0 also features an anodized coating in a variety of colors, allowing for further customization.
When used in conjunction with a fan, the ATS-10H-53-C1-R0 can provide faster cooling than other thermal solutions. This type of heat sink is designed with a low profile in order to ensure compatibility with small electronic devices such as computers, cell phones, and other small electronic equipment. The device has a low-noise operating mode, so it will not disrupt surrounding environments.
The working principle of the ATS-10H-53-C1-R0 is quite simple. The device absorbs the thermal energy generated by an electronic component, and then dissipates this energy into the atmosphere by convection and radiation. The heat generated by the electronic component is absorbed by the fins of the heat sink, and then dissipated into the surrounding environment through the pin-fins and the anodized coating.
The ATS-10H-53-C1-R0 is ideal for dissipating heat generated by high-power electronics such as processors, motor controllers, and power supplies. It is a cost-effective and reliable solution for applications requiring reliable cooling and durability at high temperatures.
The ATS-10H-53-C1-R0 heat sink is a great choice for cooling high-power electronics in high temperature environments. With its improved pin-fin design for improved air flow and cooling efficiency, its anodized coating for custom colors, and its low noise operating mode, this thermal solution is highly reliable and cost effective for dissipating heat in a variety of applications.
The specific data is subject to PDF, and the above content is for reference