| Allicdata Part #: | ATS-10H-61-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-61-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-61-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are used primarily to absorb and dissipate heat. They are commonly found in modern electronics, like computer and audio components. The ATS-10H-61-C3-R0 is a heat sink designed for use with modern electronics. This article will discuss the application field and working principle of the ATS-10H-61-C3-R0.
The ATS-10H-61-C3-R0 is designed as a general purpose heat sink to be used in a wide variety of applications. It is suitable for use in high power or high temperature situations. It provides excellent thermodynamic thermal performance due to its advanced thermal design and construction. The ATS-10H-61-C3-R0 is capable of dissipating larger amounts of heat from higher powered components than other heat sinks.
The ATS-10H-61-C3-R0 features a number of components that allow it to dissipate heat quickly and effectively. The heat sink is made from an advanced copper-based alloy that provides excellent thermal performance. The heat sink is also designed with a number of cooling fins and air intake grills that enhance the air flow around the heat sink, allowing it to dissipate more heat. Additionally, the heat sink features a large diameter base which helps to evenly spread the heat across the heat sink.
The ATS-10H-61-C3-R0\'s working principle is relatively simple. Heat is generated within a component or electronic device. The heat then radiates outward and away from the component. The heat sink sits on top of the component and absorbs the heat, dissipating it into the surrounding environment. The cooling fins increase the surface area of the heat sink, allowing it to dissipate even more heat quickly. The air intake grills also help to move cooling air around the heat sink, allowing the heat sink to dissipate even more heat.
In order for the ATS-10H-61-C3-R0 to work effectively, it must be mounted correctly. If it is not mounted correctly it may not be able to dissipate heat effectively. Additionally, the heat sink should be installed in an area that allows for proper ventilation. This will ensure that the heat can be dissipated quickly and efficiently, allowing the device to stay cooler and preventing the possibility of overheating.
The ATS-10H-61-C3-R0 is an excellent heat sink for a wide variety of applications. Its superior thermal performance and construction make it capable of dissipating and dispersing more heat than other heat sinks. Additionally, its large diameter base and cooling fins ensure that the heat is dissipated evenly and quickly. If installed correctly, the ATS-10H-61-C3-R0 will keep even the highest powered components running cool and efficiently.
The specific data is subject to PDF, and the above content is for reference