| Allicdata Part #: | ATS-10H-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are used to dissipate the heat generated by a device while it is in operation. Heat sinks are used in a variety of applications to lower the temperature of components or devices to acceptable levels. Among the various types available, one of the most popular is the ATS-10H-65-C3-R0, which is a heat sensitive device. This article will discuss the application field and working principle of the ATS-10H-65-C3-R0.
The ATS-10H-65-C3-R0 is typically used in high power devices and applications where extreme heat dissipation is required. Some of the most common applications for this type of thermal-heat sink are in computers, data centers, and other electronic components. This type of heat sink is made of a highly conductive copper core with an aluminium base. The unique shape of the sink is designed to concentrate heat along its surface area to ensure effective reduction of heat generated. Additionally, the unique shape ensures maximum contact between the heat sink and the components and devices, to maximize thermal performance.
The heat sink, when connected to a power source, will begin to dissipate heat from the connected device. The heat is quickly moved to the base of the sink by radiative and convective airflow, which involves the movement of heat from warmer surfaces to cooler ones. This will result in the temperature of the device quickly decreasing, ensuring proper operation. Additionally, the airflow produced by the heat sink’s fan helps to maintain the device’s temperature, while also providing additional cooling to the surface of the heat sink.
One of the main advantages of using the ATS-10H-65-C3-R0 thermal-heat sink is its size and weight. While the sink may be relatively small, the design of the shape and the materials used for its construction make the sink highly effective in reducing the amount of heat generated. In addition to its size and weight, the sink also offers a high degree of flexibility in its installation. It can be easily mounted on a variety of surfaces, and is also compatible with other thermal-heat sinking components.
The ATS-10H-65-C3-R0 is an efficient and effective solution when it comes to cooling high heat producing devices. Although it is typically available in small sizes, the sink’s unique shape and construction makes it capable of dissipating a large amount of heat with relative ease. Additionally, the ease of installation makes this type of thermal-heat sink a great choice for a variety of applications. With its durability, low cost, and performance, the ATS-10H-65-C3-R0 is among the best heat sinks available.
The specific data is subject to PDF, and the above content is for reference