| Allicdata Part #: | ATS-10H-69-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-69-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-69-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.49°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are designed to minimize system temperatures, increasing device performance and longevity. Heat sinks are a key component in any thermal management strategy. The ATS-10H-69-C1-R0 heat sink is an aluminum-based design used to dissipate heat generated from various electronic devices. This heat sink is designed to meet professional thermal management standards and is suitable for a variety of applications.
The ATS-10H-69-C1-R0 offers several advantages over standard heat sink designs. It is lightweight, yet its integrated aluminum fins provide excellent heat dissipation. The heat sink has a specialized build that can withstand thermal shocks while also minimizing performance issues due to overheating. The design also incorporates grooves that are precision machined to create passageways for air to flow directly over the heat source. This allows maximum heat dissipation, while also minimizing the chances of hotspots developing.
This heat sink has been designed for use in a variety of applications. It is suitable for use in consumer electronics and automotive applications. In both areas, it is used to protect components from extreme temperatures and dissipate any heat generated. It is also used in mission-critical applications such as aerospace, military, and industrial. In these applications, the heat sink is used to maintain stable operating temperatures and provide a uniform thermal distribution for the device.
The ATS-10H-69-C1-R0 is easy to install and compatible with a variety of mounting systems. It features an advanced thermal interface material (TIM), which helps increase contact between the device and the heat sink for improved heat transfer. The heat sink also comes with a full set of mounting accessories.
The ATS-10H-69-C1-R0 can effectively dissipate thermal energy from high-powered devices while remaining efficient and reliable. Its robust build can handle thermal shocks and provide good heat dissipation properties. Additionally, the heat sink is easy to install and has a variety of mounting options. This makes it a great choice for a variety of applications that require thermal management. It can be used in a variety of settings, making it an ideal thermal management solution for many different applications.
The specific data is subject to PDF, and the above content is for reference