ATS-10H-74-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.28°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction:A thermal heat sink is a device that is used to transfer heat away from components and systems that generate high levels of heat. This is especially important when cooling computer components and other electronic systems. Thermal sinks are typically made from a variety of metals, including aluminum, copper, and steel. The ATS-10H-74-C1-R0 is a specialized thermal heat sink designed to dissipate more heat than traditional sinks. This article will discuss the applications and working principles of the ATS-10H-74-C1-R0.Application Field of ATS-10H-74-C1-R0The ATS-10H-74-C1-R0 is a high-performance thermal heat sink suitable for a wide range of applications. It is commonly used in computers, electronic devices, and other high-performance applications where heat dissipation is a major priority. The sink can be used for cooling CPUs, GPUs, and other high-performance components. It is also used in industrial machinery and other systems where direct contact with air is not feasible.The ATS-10H-74-C1-R0 has an alloy-based body, which offers superior heat conduction and dissipation. It is designed to be relatively thin and lightweight, making it ideal for small-space applications, such as laptops and other mobile devices. The sink is also designed to work in environments with high vibration levels, allowing it to be used in demanding applications.Working Principle of ATS-10H-74-C1-R0The ATS-10H-74-C1-R0 dissipates heat using a combination of heat-conductive alloys and fins. Its design makes use of several layers of material, which are designed to transfer heat away from the system. The body is made from several layers of aluminum alloy and copper, while the fins are made from a mesh of aluminum and copper alloy.The fins are folded into a dense array that provides a large surface area for heat to be dissipated. Heat is absorbed by the copper alloy and transferred to the aluminum alloy, which dissipates the heat into the surrounding air. The fins also act as a barrier, preventing the heat from traveling back towards the component.Conclusion:The ATS-10H-74-C1-R0 is a specialized thermal heat sink designed to dissipate more heat than traditional sinks. It is suitable for a wide range of applications, from computers to industrial machinery. The sink is made from several layers of aluminum and copper alloy, which provides superior heat conduction and dissipation. The fins act as a barrier, preventing the heat from traveling back to the component. The ATS-10H-74-C1-R0 is an ideal choice for cooling high-performance components and systems.

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