| Allicdata Part #: | ATS-10H-86-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-86-C3-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-86-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.33123 |
| 50 +: | $ 3.14622 |
| 100 +: | $ 2.96113 |
| 250 +: | $ 2.77603 |
| 500 +: | $ 2.68350 |
| 1000 +: | $ 2.40589 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 17.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is vital for many electronic components to maintain their performance levels. Heat sinks, such as the ATS-10H-86-C3-R0, are used to manage the heat generated during operation of an electronic device by radiating it away into the surrounding environment. This ensures that components are kept cool enough to operate correctly.
The ATS-10H-86-C3-R0 is a thermoelectric heat sink with a brushed anodized aluminum base and a copper fin array. It has a rated power of 86 watts and can provide cooling to temperatures as low as -40°C. The heat sink has a 10" long footprint, making it suitable for installation in confined spaces while still providing adequate cooling performance.
The ATS-10H-86-C3-R0 operates by utilizing the Peltier effect. This effect involves the transfer of heat from one side of a material to the other when an electrical current is applied. When an electrical current is applied to the ATS-10H-86-C3-R0 heat sink, heat is removed from the cooled component and transferred to one of its side plates. This plate is then cooled by the aluminum base, which is cooled by air forced through fins. The resulting airflow from the fin array serves to dissipate the heat into the surrounding atmosphere, keeping components and other electronic devices within the system cool.
The ATS-10H-86-C3-R0 heat sink is a highly efficient thermal management solution for a wide range of applications. It can be used in high-temperature environments such as laser diodes, furnace controllers, servo controls, and motor drives. It is also suitable for cooling various types of semiconductor components, such as resistors and transistors. Additionally, the ATS-10H-86-C3-R0 can be used in medical devices, optical systems, and telecommunication systems.
The ATS-10H-86-C3-R0 is easy to install and operates silently, while providing a consistently reliable performance. With its small size, high efficiency, and low operating costs, the ATS-10H-86-C3-R0 is an ideal choice for a wide range of thermal management applications.
The specific data is subject to PDF, and the above content is for reference