ATS-10H-88-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.11°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-10H-88-C2-R0 Application Field and Working Principle

Introduction

Thermal - heat sinks are used in a variety of applications, ranging from industry to military operations. The ATS-10H-88-C2-R0 is a thermal - heat sink specifically made for high power electronic components. This type of heat sink is designed to direct the generated heat away from the component to ensure it\'s longevity. The ATS-10H-88-C2-R0 is available in a range of sizes, providing an optimal dissipating solution for components of various power levels.

Application Field

The reason thermal - heat sinks are used in different industries, is due to their durability and ability to provide efficient cooling to the component it will be cooling. This type of heat sink is typically used for high-powered components, such as power supplies and amplifiers. The ATS-10H-88-C2-R0 is no exception, and is designed to provide efficient cooling for the component it will be cooling.This type of heat sink is also used for components with a higher power rating. The ATS-10H-88-C2-R0 is a suitable solution for high-powered components used in military operations. This type of heat sink is designed to dissipate high levels of heat energy, which is essential for components that need to function in higher temperatures.

Working Principle

The ATS-10H-88-C2-R0 is a thermal-heat sink designed to take the heat produced by the component it is cooling and direct it away from the component. The heat is then dissipated through the fins of the heat sink. This is done by the dissipating process which is the transfer of heat from a higher to a lower temperature region.The heat generated by the component is conducted through the heat sink by conduction. Heat is transferred by conduction when heat passes through substances like metal, plastic, or ceramic. The heat passes through the heat sink, and is then directed away by the fins. As the heat passes through the fins, the heat is absorbed, thus directing it away from the component.

Conclusion

The ATS-10H-88-C2-R0 is a thermal-heat sink specifically designed for high-power electronic components. This type of heat sink is made with an efficient dissipating design to ensure the component\'s longevity and increased performance. The heat generated by the component is conducted through the heat sink by conduction, and direct it away from the component. This is done by the dissipating process where the heat is transferred from a higher to a lower temperature region.

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