| Allicdata Part #: | ATS-10H-88-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-88-C3-R0 |
| Price: | $ 3.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-88-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.52800 |
| 30 +: | $ 3.33186 |
| 50 +: | $ 3.13589 |
| 100 +: | $ 2.93990 |
| 250 +: | $ 2.74390 |
| 500 +: | $ 2.54791 |
| 1000 +: | $ 2.49892 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks have been used in various areas of thermal management for many years due to their great heat dissipating capabilities. One of the most popular and widely used heat sinks on the market today is the ATS-10H-88-C3-R0. This device provides reliable operation in numerous applications and environments.
The function of the ATS-10H-88-C3-R0 for thermal management is to draw heat away from a component or device and then dissipate it into the surrounding environment. This device is typically used in computers for cooling the CPU, keeping it from getting too hot and resulting in potential damage. It can also be used in military or aerospace applications, taking advantage of its highly efficient cooling capabilities.
The ATS-10H-88-C3-R0 is composed of a multiple finned, extruded aluminum heat sink, bonded to a copper plate. The aluminum fins provide optimal heat dissipation and the copper plate assists the heat transfer from the device to be cooled and into the heat sink. This design ensures higher heat dissipation and lower operating temperatures than other heat sink designs.
The ATS-10H-88-C3-R0 works on a principle known as convection thermal management. This involves the use of air currents created by temperature differences to move heat away from a component and into the atmosphere. The device uses a fan to draw air in from the outside, across the fins of the heat sink. The fins absorb the heat and spread it over a wider area while the fan blows the heated air away from the device, reducing its temperature.
The ATS-10H-88-C3-R0 is a highly efficient device designed specifically for thermal management applications. It is well suited for operations in tough environments such as military and aerospace, and is also used in numerous other similar applications. The device is ideal for use in computers, providing efficient cooling of the CPU and other components.
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