| Allicdata Part #: | ATS-10H-89-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-89-C1-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-89-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-10H-89-C1-R0 is a thermal - heat sink, it is used to help dissipate the heat generated by electrical components.
Heat sinks components are used in a variety of electronic devices and have been around for many years. The ATS-10H-89-C1-R0 is a type of Passive Heat Sink, using heat conduction to take away heat from the component it is attached to. It is usually made from an aluminum alloy and has a finned surface that increases the surface area to help dissipate heat. It is designed to offer a low-cost solution for applications where cooling is needed but fans are not preferred.
The ATS-10H-89-C1-R0 works on the principle of natural convection. Heat is naturally transferred from the component to the fins of the heatsink in what is called natural convection, this transfer happens because the cooler fins of the heat sink draw the heat off causing the surrounding air to heat up and rise. This convection loop creates a flow of air that helps dissipate the heat away more quickly.
The ATS-10H-89-C1-R0 is typically used in applications such as computers, laptops, digital cameras, gaming consoles, and other electronic devices. For computer systems like CPUs and GPUs, the associated heat is dissipated by the ATS-10H-89-C1-R0 heat sink. With laptops, the ATS-10H-89-C1-R0 is attached to components such as the CPU, GPU, and other chipsets. This is because they tend to generate a significant amount of heat during operation.
Lower power devices such as gaming consoles and digital cameras usually have smaller form factors and cannot allow the use of fans. As a result, their heat dissipation needs to be handled by the ATS-10H-89-C1-R0 passive heat sink.
The ATS-10H-89-C1-R0 has a low cost and is able to maintain a low profile making it well suited for a variety of applications. It is available in a variety of sizes and shapes to meet specific requirements. In addition, the heat sink can be easily attached using standard mounting methods.
The ATS-10H-89-C1-R0 thermal - heat sink is a highly effective way to dissipate the heat generated by a variety of electronic devices. Its low-cost and efficient design make it the perfect choice for applications where fans cannot be used. By effectively using natural convection, the ATS-10H-89-C1-R0 helps to keep delicate components cool, thus protecting them from damage due to overheating.
The specific data is subject to PDF, and the above content is for reference