| Allicdata Part #: | ATS-10H-93-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-93-C3-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-93-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are essential components of almost all electronic systems. ATS-10H-93-C3-R0 is one of the most popular models in the market for use in various electronic equipment.
Application Field
The ATS-10H-93-C3-R0 heat sink is used widely in industrial, scientific, medical (ISM) and automotive applications. It can also be found in computers, laptop computers, mobile phones, digital cameras, set-top boxes, televisions and other electronic devices. This type of heat sink is mainly used for cooling the circuit board and extending the life of components. It prevents heat dissipation and ensures efficient heat transfer, thereby achieving the highest possible performance in electronic devices.
Working Principle
The overall principle of the ATS-10H-93-C3-R0 heat sink is that it draws in hot air that builds up around the circuit board and dissipates it away from the board. The thermally conductive material that makes up the heat sink allows heat to be moved from the heat-generating components on the board, directly to the heat sinks. The basic construction of the heat sinks consists of a solid metal core surrounded by a thermally conductive material. The thermally conductive material increases both air movement and surface contact with the surrounding air.
The fins on the heat sink are designed to further aid in the dissipation of heat away from the board. By providing a larger surface area for air to move through, and by increasing the air flow, the heat sinks provide an effective means of cooling the circuitry. The increased air flow helps to dissipate heat faster. Heat sinks also help to protect the circuit board from overheating, by drawing away the extra heat.
In conclusion, the ATS-10H-93-C3-R0 heat sink offers an effective cooling solution for a variety of industrial and consumer electronic products. The thermally conductive material, fins, and increased air flow all help to draw away heat, protecting the circuitry from potential harm. It is available in a variety of sizes to suit any application, making it a popular choice for many types of electronic systems.
The specific data is subject to PDF, and the above content is for reference