| Allicdata Part #: | ATS-10H-95-C3-R0-ND |
| Manufacturer Part#: |
ATS-10H-95-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-95-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important in various industries as increased demand for accuracy in temperature-controlled and temperature-sensitive devices has grown. The ATS-10H-95-C3-R0 Heat Sink, a unique product from HECSOR, has been designed to meet these demands.
The ATS-10H-95-C3-R0 is a highly efficient heat sink designed for applications that require high-thermal performance and reliability. The core of the product is a highly efficient high-density copper fin structure which works in synergy with the unique design of the radiating fins. This combination of advantages provides superior thermal performance and reliability, giving the product the ability to transfer heat away from critical components.
The ATS-10H-95-C3-R0’s efficient thermal properties are achieved through its unique design. The heat sink is constructed using two layers – a copper plate inside and a fin outside – which enables efficient heat transfer and cooling in any environment. The heat sink also features a copper-clad aluminum base which provides additional thermal performance and extended life expectancy.
The ATS-10H-95-C3-R0 heat sink is designed to be used in applications such as high-speed data processing, high-powered computer and telecommunications systems, and high-performance automotive and electronics applications. Additionally, its uniquely designed fins allow for efficient air flow in any system and offer excellent heat dissipation in any environment.
In order to ensure optimal performance, the Heat Sink must be correctly installed and its core components must be installed correctly. The heat sink should be mounted onto any system in such a way that the airflow is not obstructed and that the heat is able to dissipate effectively. A correctly installed ATS-10H-95-C3-R0 heat sink will ensure that components are cooled to the required temperature, thus reducing the risk of overheating.
The ATS-10H-95-C3-R0 Heat Sink from HECSOR is a reliable and efficient heat sink solution that is designed to meet the thermal management needs of a variety of applications. Its unique design offers superior heat transfer and cooling capabilities, ensuring maximum performance and reliability in any system.
The specific data is subject to PDF, and the above content is for reference