| Allicdata Part #: | ATS-10H-98-C1-R0-ND |
| Manufacturer Part#: |
ATS-10H-98-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-10H-98-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Introduction to Thermal - Heat Sinks
Thermal - Heat Sinks are designed to help dissipate heat away from delicate parts, electronic components and systems. This is most commonly done with a heat sink which is composed of a block of metal with fins or plates on the surface. The fins are designed to disperse the heat from the source of the heat away from the delicate components and systems that require protection from heat. Thermodynamics and the principles of transfer of energy help in understanding the role of heat sinks.
ATS-10H-98-C1-R0 application field and working principle
The ATS-10H-98-C1-R0 is a thermal heat sink system designed to provide cooling to electronic components, by transferring the heat away from the components that generate it. The ATS-10H-98-C1-R0 consists of a heat sink block and a fan system. The heat sink block is made of a metal housing with aluminum fins. The aluminum fins allow the heat to be dissipated quickly, through the large surface area of the fins. The fan directs the flow of air through the heat sink, which further accelerates the transfer of heat away from the electronic components.
The heat from the component is transferred through conduction to the heat sink. In a process known as convection, the airflow generated by the fan helps to move the heat away from the heat sink and away from the components. The use of a fan also helps in cooling larger, hotter components that can’t be adequately cooled by the heat sink alone. The fan speed can be adjusted to ensure optimal cooling for the application.
The ATS-10H-98-C1-R0 thermal heat sink system is most commonly used for cooling components in computers, telecommunication equipment, data center storage systems, solar power systems, and any other application where heat needs to be dissipated away from heat-sensitive components. The system offers good thermal performance, low power consumption and high reliability.
Conclusion
The ATS-10H-98-C1-R0 thermal heat sink system is an effective way to dissipate heat away from heat-sensitive components. It is comprised of an aluminum heat sink with fin design to quickly transfer the heat, and a fan system to further accelerate the transfer of heat away from the component and away from the system. The ATS-10H-98-C1-R0 is popular for computer, telecommunication, storage, solar power applications and any other application where heat needs to be dissipated from the components.
The specific data is subject to PDF, and the above content is for reference