ATS-10H-98-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.39°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
Thermal - Heat Sinks are essential components in many types of high-performance electronic equipment due to their ability to efficiently dissipate heat. The ATS-10H-98-C3-R0 is a thermal-grade heat sink whose application field and working principle will be discussed in this article. Application Field
The ATS-10H-98-C3-R0 is designed to provide cooling for LED and other high-output light sources. It has a high level of thermal conductivity due to its advanced AlSiC (aluminum-silicon-carbide) heat sink material, along with its enlarged aluminum base plate and grooved fins. All of these features result in improved heat transfer speed and minimized temperature build-up, making it an ideal choice for heat-sensitive applications. The ATS-10H-98-C3-R0 also provides efficient cooling for amplifiers, power supplies, and other electronic components that could otherwise be damaged by overheating. Its design makes it capable of dissipating enough heat into the environment to keep the temperature below the critical level and protect sensitive components from thermal runaway. Working Principle
When heat builds up inside an electronic system, it must be quickly extracted and released into the environment to avoid damage to the system. The ATS-10H-98-C3-R0 is built with a large aluminum base plate that enables it to capture and absorb heat more efficiently than other heat sinks. In addition, the grooved fins ensure that the heat is quickly dissipated into the environment through convection.The grooved fins of the ATS-10H-98-C3-R0 also expand the surface area of the heat sink, which allows more air to be drawn in and further assists with quicker heat dissipation. The enlarged aluminum base plate also aids the process of heat absorption and dissipation by providing more surface area for heat to move onto. Meanwhile, the AlSiC material used in the ATS-10H-98-C3-R0 provides a higher level of thermal conductivity than aluminum, which allows the heat sink to absorb and transfer heat more quickly. This allows the heat sink to dissipate all of the excess heat quickly and efficiently, thus preventing any temperature build-up and protecting sensitive components from thermal runaway.Conclusion
The ATS-10H-98-C3-R0 is a thermal-grade heat sink that is designed to provide efficient cooling for LED and other high-output light sources, as well as an array of power supply, amplifier, and other electronic components. Its advanced AlSiC material, enlarged aluminum base plate, and grooved fins work together to provide improved heat transfer speed and minimized temperature build-up. In summary, the ATS-10H-98-C3-R0 is an excellent choice for heat-sensitive electronic applications. By quickly and efficiently absorbing and dissipating heat, it is able to protect expensive and delicate components from the risk of overheating and damage.

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