ATS-1106-C1-R0

Series:	maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	Half Brick DC/DC Converter
Attachment Method:	Bolt On
Shape:	Rectangular, Angled Fins
Length:	2.402" (61.00mm)
Width:	2.323" (59.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.902" (22.90mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	1.30°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Gold Anodized

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Thermal-Heat Sinks: ATS-1106-C1-R0 Application Field and Working Principle

Heat sinks are widely used to dissipate and dispose of heat generated by electronic components. The most popular type of heat sink is the ATS-1106-C1-R0. This type of heat sink is commonly used in a variety of thermal management applications such as consumer electronics, automotive electronics, military electronics and telecommunications.The ATS-1106-C1-R0 Heat Sink is a highly versatile range of single-row heat sinks. It is available in a variety of sizes and shapes, ranging from a small 4mmx4mm device to a large device measuring 500mmx500mm. The heat sink has a unique sliding clip mechanism which allows it to be easily mounted and removed from electronic components for easy maintenance.The ATS-1106-C1-R0 can be used for the cooling of a wide range of electronic components including microprocessors, FETs, voltage regulators, CPUs, GPUs, MCUs and ASICs. The heat sink also provides excellent cooling performance even under high-performance conditions such as high temperature and/or high current.The working principle behind the ATS-1106-C1-R0 heat sink is based on four main principles: thermal radiation, conduction, convection and cooling. The first principle is thermal radiation, which is the transfer of heat through an object or medium. The ATS-1106-C1-R0 has a highly reflective surface which absorbs and disperses the heat generated by the electronic components.The second principle is conduction, which is the transfer of heat across two different materials. The ATS-1106-C1-R0 heat sink has a highly conductive aluminum base which transfers the heat generated by the components to the heat sink.The third principle is convection, which is the transfer of heat through air. The air around the ATS-1106-C1-R0 heat sink is cooled by convection, which ensures the rapid dissipation of the heat generated by the components.The fourth principle is cooling, which is the most crucial part of the heat sink’s performance. Inside the ATS-1106-C1-R0 heat sink there is a thermally conductive heat sink material, which is designed to draw the heat away from the electronic components, transferring it to the aluminum base.The ATS-1106-C1-R0 heat sink is a highly effective way of dissipating and disposing of heat generated by electronic components. Its versatile design makes it the ideal solution for various thermal management applications. With its unique sliding clip mechanism and highly conductive aluminum base, the ATS-1106-C1-R0 is able to provide superior cooling performance even under high-performance conditions. The combination of these four principles makes the ATS-1106-C1-R0 one of the most efficient heat sinks in the market today.

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