| Allicdata Part #: | ATS1508-ND |
| Manufacturer Part#: |
ATS-1109-C1-R0 |
| Price: | $ 10.05 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | FULL BRICK HEATSINK 117X61X11.4M |
| More Detail: | Heat Sink Full Brick DC/DC Converter Aluminum Top... |
| DataSheet: |  ATS-1109-C1-R0 Datasheet/PDF |
| Quantity: | 143 |
| 1 +: | $ 9.12870 |
| 10 +: | $ 8.61903 |
| 25 +: | $ 8.11216 |
| 50 +: | $ 7.60522 |
| 100 +: | $ 7.09814 |
| 250 +: | $ 6.59119 |
| 500 +: | $ 6.46437 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Full Brick DC/DC Converter |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Angled Fins |
| Length: | 4.598" (116.80mm) |
| Width: | 2.401" (61.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.449" (11.40mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Gold Anodized |
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Thermal - Heat Sinks have been instrumental in diverting any unwanted heat away from sensitive components, in order to preserve the performance of the equipment. The ATS-1109-C1-R0 Heat Sink is a highly efficient heatsink, designed for maximum heat transfer. It is a reliable and robust cooling solution for applications requiring high thermal performance, including those found in high-end components.
The ATS-1109-C1-R0 is a four-pin, active cooling solution, which is capable of dissipating up to 10 W of heat. It features four separate pins, which are designed to be soldered and directly attached to the product. The pins are designed to provide passive cooling, while the fan assembly ensures efficient heat transfer from the device to the heatsink. This heat sink utilizes a proprietary design, which is optimized for high-power applications, such as microprocessors and other high-performance components.
The ATS-1109-C1-R0 is an ideal solution for applications requiring efficient cooling. It is specifically designed to provide superior thermal performance in high-power applications. The heatsink also offers a low profile design, which enables it to fit into tight spaces without sacrificing performance. In addition, the heatsink utilizes a combination of metal and plastic material, which ensures a lightweight and durable construction.
The main working principle of ATS-1109-C1-R0 lies in its fan assembly. The fan is designed to draw air from outside the heatsink, which helps to dissipate the heat generated inside the component. As the air passes across the heatsink, it absorbs the heat, causing it to expand. This expansion causes the air flow through the heatsink to be warmed, which helps to reduce the temperature of the component. The warmer air is then expelled through the vents, which help to keep the component cool.
The ATS-1109-C1-R0 is designed to provide optimized thermal performance in applications that require a high degree of heat control. It is ideal for applications such as servers, workstations and gaming PCs, which require high-performance and reliable cooling solutions. Moreover, the ATS-1109-C1-R0 is also suitable for use in medical and industrial applications, such as DSPs and other high-powered devices.
The ATS-1109-C1-R0 is a highly efficient and reliable heatsink, capable of delivering superior thermal performance in applications where high degree of heat management is required. The heatsink is suitable for use in various commercial and industrial applications, such as servers, workstations and gaming PCs. Additionally, its low-profile design enables it to be integrated into tight spaces without sacrificing performance.
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