| Allicdata Part #: | ATS1505-ND |
| Manufacturer Part#: |
ATS-1144-C1-R0 |
| Price: | $ 8.62 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | 1/2 BRICK HEATSINK 58X61X11.4MM |
| More Detail: | Heat Sink Half Brick DC/DC Converter Aluminum Top... |
| DataSheet: |  ATS-1144-C1-R0 Datasheet/PDF |
| Quantity: | 225 |
| 1 +: | $ 7.83720 |
| 10 +: | $ 7.39872 |
| 25 +: | $ 6.96377 |
| 50 +: | $ 6.52844 |
| 100 +: | $ 6.09323 |
| 250 +: | $ 5.65798 |
| 500 +: | $ 5.54918 |
| 1000 +: | $ 5.44036 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Half Brick DC/DC Converter |
| Attachment Method: | Bolt On |
| Shape: | Rectangular, Angled Fins |
| Length: | 2.323" (59.00mm) |
| Width: | 2.401" (61.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.449" (11.40mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Gold Anodized |
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The ATS-1144-C1-R0 is a thermal-heat sink designed by ATS, a major thermal management solutions provider. The product is designed to improve the thermal performance of electronic components by dissipating heat from its surface. The device is designed to provide a stable, reliable, and efficient thermal performance even under the toughest conditions.
ATS-1144-C1-R0 Application Field
ATS-1144-C1-R0 is designed to be used in different application fields. It is used as a cooling device in both air and liquid cooling systems. It is suitable for use in harsh thermal environments, such as computer and hardware cooling, as well as telecommunications and medical equipment. Additionally, the device is suitable for use in power supply modules, digital signal processors, and other high-power electronic components.
ATS-1144-C1-R0 Working Principle
The ATS-1144-C1-R0 thermal-heat sink utilizes a heat-pipe-based design that takes full advantage of the thermal conductivity of copper to dissipate heat from the device’s surface. The heat-pipes are connected to a thin copper plate, which helps to spread heat evenly throughout the entire surface. The heat-pipe also causes air to be circulated around the device surface, further aiding heat dissipation.
The ATS-1144-C1-R0 also features a specially designed fin-structure that is critical for improving the heat transfer performance. This intricate fin-structure ensures that hot air is rapidly exchanged from one side of the device to the other side, thus preventing hotspots and allowing for an even cooling throughout the device surface.
ATS-1144-C1-R0 is also designed to be highly efficient, consuming minimal energy for its size and power output. The device is equipped with a thermal-electrical interface device, which allows for the direct use of modern electronic components such as 50-ohm resistors or chokes.
The ATS-1144-C1-R0 thermal-heat sink is suitable for applications ranging from hardware and computer cooling to telecommunications. It is designed to provide reliable and efficient cooling even in the most demanding thermal environments.
The specific data is subject to PDF, and the above content is for reference