ATS-1151-C1-R0

Series:	maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	Full Brick DC/DC Converter
Attachment Method:	Bolt On
Shape:	Rectangular, Angled Fins
Length:	2.402" (61.00mm)
Width:	4.646" (118.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.769" (19.55mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	0.50°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Gold Anodized

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Thermal - Heat Sinks: ATS-1151-C1-R0 Application Field and Working Principle

Heat sinks are an essential component in modern systems and applications. Primarily, they are used to prevent temperature-related failures and extend the lifespan of electronic components. The ATS-1151-C1-R0 is a versatile heat sink with a wide range of applications and a reliable working principle.

Applications

The ATS-1151-C1-R0 can be used as a cooling solution for processors, digital signal processors (DSPs), graphics processing units (GPUs), memory modules, and other components that generate high levels of heat. It is particularly well suited to cooling components with low surface area, such as microprocessors and memory modules. In addition, it can also be used to cool other components that require less heat dissipation, such as audio amplifiers and power regulation components.

Design and Construction

The ATS-1151-C1-R0 consists of a main block made of aluminum alloy. The block has a pressed fin design which maximizes heat transfer and ensures high air flow. There are three mounting holes, which can be used to attach the heat sink to the desired component. It also features integral thermal interface material (TIM) which helps to spread the heat evenly across the heat sink and improve cooling performance.

Working Principle

The ATS-1151-C1-R0 uses a combination of convection and conduction to dissipate heat. The combination of the pressed fins on the main block and the TIM helps to conduct heat away from the component and transfer it to the surrounding air. The air flow generated by the fins causes convection currents which aid in dissipating the heat over a greater area. This ensures that the component remains cool.

Conclusion

The ATS-1151-C1-R0 is an effective heat sink, with a wide range of applications. Its pressed fin design and thermal interface material ensure high performance cooling that will extend the lifespan of electronic components. With its combination of convection and conduction, it is an ideal solution for cooling processors, DSPs, GPUs, and other components that generate a significant amount of heat.

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