ATS-1184-C1-R0

Series:	maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	Eighth Brick DC/DC Converter
Attachment Method:	Bolt On
Shape:	Rectangular, Angled Fins
Length:	0.900" (23.00mm)
Width:	2.323" (59.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.449" (11.40mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.70°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Gold Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

A heat sink is a device that absorbs and dissipates heat from other objects. Its main purpose is to reduce the temperature of the object that it is applied to, usually a component within a larger system. The ATS-1184-C1-R0 heat sink is designed to take on these tasks and do so with efficiency and precision.The ATS-1184-C1-R0 heat sink is designed to dissipate heat effectively from components operating under extreme temperatures. It is designed to achieve a reliable transfer of heat from the component to the sink, allowing for an even distribution of temperature throughout the component. This helps the component to reach the optimal temperature quickly and to keep it at that temperature longer. When used correctly, the ATS-1184-C1-R0 efficiently works to reduce the temperature of the components, improving their performance and extending their life span.The ATS-1184-C1-R0 heat sink is designed to be used in a variety of applications. It is often used in applications which require high power dissipation such as in power amplifiers, high-end audio systems, power cord designs and other similar applications. It can also be used in laptops, desktops, small form factor workstations, and other electronic devices that require improved heat dissipation.The ATS-1184-C1-R0’s working principle is simple but highly efficient. It operates by convection, which is the transfer of heat through the air from one place to another. The transfer begins when warm air is drawn away from the component’s heatsink by the upper fins. The air is then cooled by the lower fins, and then released to maintain the flow of cooling air. By ensuring an efficient transfer of heat, the ATS-1184-C1-R0 can quickly and reliably cool components while providing improved performance and longer life span.The ATS-1184-C1-R0 heat sink is designed with an impressive heat transfer rate of up to 200 watts, making it an ideal choice for cooling even the most demanding components. It is designed to be efficient and reliable, improving system performance and extending component life. The ATS-1184-C1-R0’s low profile design and lightweight construction make it an ideal solution for applications which require high power dissipation without taking up too much space.Overall, the ATS-1184-C1-R0 heat sink is a reliable and efficient way to keep components running as if they were brand new. It is designed to operate with maximum efficiency, allowing for longer life span of components while providing improved performance. With its impressive heat transfer rate and low profile design, the ATS-1184-C1-R0 is an ideal solution for a variety of thermal applications.

The specific data is subject to PDF, and the above content is for reference