| Allicdata Part #: | ATS-11A-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-11A-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component for a wide range of electronic systems. Heat sinks are one of the most widely used thermal management components, as they provide effective and reliable heat removal from components and allow for the thermal regulation of a wide variety of electronic systems. The ATS-11A-10-C1-R0 is a heat sink that is extremely efficient in the thermal management of a variety of electronic systems.
The ATS-11A-10-C1-R0 heat sink is a single-stage radiant heat sink. This heat sink is made from aluminum and is designed to provide effective heat removal to a wide variety of electronic components. It works by dissipating heat away from the component through radiation and convection, and also provides a low resistance pathway for conducting heat away from the component. This heat sink is designed to be highly efficient and reliable in removing heat from electrical components.
The ATS-11A-10-C1-R0 heat sink is capable of providing effective heat removal to a number of different applications. This heat sink is capable of dissipating heat from many types of electrical components such as CPUs, GPUs, chipsets, memory modules, power components, and various other types of electronic components. It is also capable of providing effective thermal regulation for the many types of electronic systems in which these components are utilized. This heat sink is effective in providing reliable and efficient thermal management to these electronic systems.
The ATS-11A-10-C1-R0 heat sink utilizes a combination of radiation and convection principles to conduct heat away from the component and provide thermal regulation. The aluminum construction of the heat sink is designed to dissipate heat through the process of radiation, which is the transfer of heat between two separate objects through the emission and absorption of electromagnetic waves. The advantage of this type of radiation is that it can dissipate heat over a large area with minimal loss of efficiency due to resistance. The convective heat transfer principle is utilized as well, and involves the movement of heat through air or other gases and liquids. This method will move heat away from the component as the warm air or liquid rises, replacing it with cooler air or liquid.
The ATS-11A-10-C1-R0 heat sink is an extremely efficient and reliable heat sink for thermal management. It is capable of providing effective and reliable heat removal to a wide variety of electronic components, and is also capable of providing effective thermal regulation to electronic systems. This heat sink is designed to offer reliable performance and excellent thermal management to components and systems.
The specific data is subject to PDF, and the above content is for reference