ATS-11A-127-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.84°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-11A-127-C2-R0 is a thermal solution designed to help reduce and manage the heat created by electric components and devices. The thermal solution is an advanced design of a heat sink which takes advantage of natural air convection to draw away heat from the component and disburse it throughout the surrounding environment.

Thermal - Heat Sinks

Thermal - Heat Sinks are used to absorb and dissipate large amounts of heat, generated by electronic components, in a controlled and efficient manner. This thermal solution works by taking advantage of natural air convection to draw heat away from the component and disperse it throughout the surrounding environment. The thermal material employed in this solution is based on an aluminum alloy with a high thermal conductivity value.The heatsink is thin enough that it will fit into a wide variety of tight spaces and deliver excellent performance in keeping the temperature of the components low. This is achieved through the thermal design of the sink by the strategic placement of fins spread across the surface that maximize air convection. Additionally, the fins on the sink create greater surface area for air to contact the sink and absorb more heat from the component. This increase in thermal dissipation capabilities results in a high-performance thermal solution to keep the component running at optimal temperatures.

Application Field and Working Principle

The ATS-11A-127-C2-R0 thermal solution is best suited for applications that require cooling with natural air convection. The thermal solution can be used in various industries such as aviation, automotive, and electronics. Additionally, it is a great choice for applications where manufacturers want to reduce reliance upon external fans, such as servers and other high-end machines. The working principle is split into two stages, the first stage is cooling the component by the natural air convection, and secondly, the passive heat dissipation of the heat conduit. The thermal solution is constructed of a special aluminum alloy, which is known for its high thermal conductivity value. The aluminum material contracts the heat energy at a faster rate compared to other materials, hence, it is able to draw away the heat energy from the component quickly, and dissipate it over a large area.In the second stage, the passive heat dissipation helps in maintaining the temperature of the component by reducing the thermal load from the component. The design of the heat sink includes a large number of fins that are strategically placed to ensure that the air around the intermediate fins is always moving in the same direction. This helps in utilizing natural convection, thereby cooling the component even further. The fins also help in increasing the surface area of the sink, and hence, increasing the cooling efficiency.

Conclusion

The ATS-11A-127-C2-R0 Thermal -Heat Sink solution is an excellent choice for applications requiring a thermal solution that utilizes natural air convection to reduce temperatures of components. The aluminum alloy of the heatsink is known to have high thermal conductivity properties that help in dissipating heat away quickly and efficiently. Additionally, the strategic placement of fins helps to maximize natural air convection and further increase the thermal efficiency of the sink. As this thermal solution is able to support long components, it is an ideal choice for numerous industries, such as aviation, automotive, and electronics.

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